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CL05B223KB5VPNC
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- SAMSUNG CL05B223KB5VPNC
- Type
- SAMSUNG
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SAMSUNG
- Electronic Component
- CL05B223KB5VPNC
- Electronic Component
- 1
- Electronic Component
- 22nF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.013g
- Electronic Component
- 1
- Electronic Component
- BM0257686737
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CL05B223KB5VPNC 产品概述
一、产品简介
CL05B223KB5VPNC 是三星（SAMSUNG）系列贴片多层陶瓷电容（MLCC），封装为 0402（公制 1005），标称电容值 22nF（223），公差 ±10%（K），额定电压 50V，介质材料等级 X7R。该器件面向对体积和性能有较高要求的便携与工业电子设备，提供稳定的通用去耦、滤波与旁路功能。
二、主要参数
- 容值：22nF（22,000 pF）
- 公差：±10%（K）
- 额定直流电压：50V
- 介质：X7R（温度范围常见 -55°C 至 +125°C，随温度变化电容值约在 ±15% 范围内）
- 封装：0402（1005 公制）
- 品牌：SAMSUNG
三、性能特点
- 小型封装、体积小、适合高密度安装。
- X7R 类介质在宽温区间内保持较好的电容稳定性，适合一般旁路与滤波场合。
- 低等效串联电阻（ESR）与低等效串联电感（ESL），有利于高频去耦性能。
- 额定 50V 提供良好耐压能力，适用于中低电压电源轨设计。
- 表面贴装，兼容无铅回流焊工艺。
四、典型应用
- 电源去耦与旁路（DC-DC 转换器输入/输出滤波）
- 高频滤波与噪声抑制（模拟与数字混合电路）
- 时序与振荡电路中的耦合/定时电容
- 手持终端、物联网模块、消费电子、工业控制板等高密度布局场景
五、封装与识别
型号中“223”即表示 22×10^3 pF = 22nF，“K”代表 ±10% 公差，“05/0402” 通常指封装规格，后缀为厂家工艺/包装与品质代码。订购时请以供应商数据表与料号全码为准，确认卷带、盒装等包装形式。
六、布局与焊接建议
- 将 MLCC 尽可能靠近被去耦器件的电源引脚放置，以减小回路面积与寄生感抗。
- 采用对称焊盘与合理过孔设计，避免应力集中，焊盘尺寸参考三星或 IPC 推荐图样。
- 兼容常规回流焊工艺，但对湿敏性元件应按 JEDEC/MIL 规范储存并在必要时回流前烘烤。
- 在高电压/高温或频繁热循环环境下，建议进行实际测试以验证长期稳定性与焊接可靠性。
七、可靠性与注意事项
- X7R 为类 II 陶瓷，存在温度与直流偏压（DC bias）引起的电容下降现象；在高偏压或高场强下应测量实际有效电容以确认设计裕量。
- 小尺寸封装在机械应力或热循环下可能发生裂纹，建议合理板型与应力释放设计。
- 推荐在采购与生产中参考三星最新规格书、放电测试与寿命可靠性数据。
八、采购与替代型号
CL05B223KB5VPNC 适合需要 22nF/50V/0402 的通用方案。若需不同电压、公差或介质，可选用相同封装下的其他电压等级或不同温度特性的 MLCC。采购时注意批次与规格书一致，样品验证建议在目标应用工况下完成。
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