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CL10B104KB8NNNC
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- SAMSUNG CL10B104KB8NNNC
- Type
- SAMSUNG
- Unit
- Electronic Component
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- SAMSUNG
- Electronic Component
- CL10B104KB8NNNC
- Electronic Component
- 1
- Electronic Component
- 100nF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.05g
- Electronic Component
- 1
- Electronic Component
- BM0000000787
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：CL10B104KB8NNNC
一、产品简介
CL10B104KB8NNNC 是一款由三星（SAMSUNG）公司制造的高性能多层陶瓷电容器（MLCC）。该电容器是一种表面贴装（SMD）元件，广泛应用于电子电路中，主要用于去耦、滤波和能量存储等功能。其电气性能和优越的环境适应性使其成为现代电子产品中不可或缺的组成部分。
二、主要规格
电容值：0.1µF，或100nF，这一容量值在许多应用中非常常见，足以满足对高频去耦和滤波的需求。
额定电压：50V，该电压等级使得该电容能够在较高电压条件下安全运行，适用于需要稳定工作的场合。
容差：±10%，相对较好的容差使得用户能够在设计中有更大的灵活性，确保电路性能的稳定性。
温度系数：X7R，这种材料的温度系数在-55°C 到 +125°C 的范围内具有较好的温度稳定性，适合于各种环境条件下工作。
工作温度范围：该器件的工作温度范围为-55°C 到 +125°C，具有出色的热稳定性，适合于高温和低温环境下的应用。
封装类型：0603（1608公制），这种小型封装适用于空间受限的应用，提高了产品的设计自由度，同时也能有效减小PCB板的占用面积。
最大厚度：0.035"（0.90mm），极薄的尺寸使得该电容能够很好地适配各种新型电子产品的紧凑设计。
三、应用领域
CL10B104KB8NNNC 在多个领域具备广泛的应用前景，包括但不限于：
消费电子：智能手机、平板电脑、笔记本电脑等设备中使用，进行电源去耦和高频滤波，确保电路稳定运行，降低噪声干扰。
工业设备：在工业自动化设备中，作为电源管理元件，帮助抑制电源脉动，确保设备的可靠性和延长服务寿命。
汽车电子：在汽车应用中，广泛用于车载电子设备的电源电路中，具备优良的耐高温特性，能够承受汽车工作环境中的恶劣条件。
医疗设备：用于医疗仪器中，以确保设备功能的稳定性和安全性，保护敏感电路。
四、产品特性
- 高可靠性：该电容器在严苛的温度和环境条件下仍保持良好的性能，极大提高了电子产品的整体可靠性。
- 低功耗：由于其材料特性，CL10B104KB8NNNC 在工作时展现出低功耗特性，有助于延长电池供电设备的使用时间。
- 小型化设计：0603封装的设计满足现代电子产品对小型化和轻量化的需求，便于产品的整体设计和布局。
五、总结
CL10B104KB8NNNC 是一款性能卓越、用途广泛的多层陶瓷电容器，具备出色的电气特性和可靠性，适用于各种工业和商业领域。作为三星的优质产品，它不仅能有效满足高频去耦和滤波的需求，还能在极端的环境条件下保持稳定的性能，是当今电子元器件市场中值得信赖的选择。设计人员可以放心地将其集成到各种产品中，从而提升产品的性能和可靠性。
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