Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
CL21B225KBYVPNE
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- SAMSUNG CL21B225KBYVPNE
- Type
- SAMSUNG
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SAMSUNG
- Electronic Component
- CL21B225KBYVPNE
- Electronic Component
- 1
- Electronic Component
- 2.2uF
- Package
- 0805
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.034g
- Electronic Component
- 1
- Electronic Component
- BM0257686756
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 2000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CL21B225KBYVPNE 产品概述
一、基本参数
- 容值：2.2 μF（225）
- 精度：±10%（K）
- 额定电压：50 V DC
- 温度系数：X7R（-55°C 至 +125°C，温度引起的电容变化在规定范围内）
- 封装：0805（2012公制，约2.0 × 1.25 mm），厚度 1.25 mm
- 品牌：SAMSUNG（三星）
- 类型：车规用多层陶瓷电容（MLCC）
二、主要特性与电气性能
CL21B225KBYVPNE 采用 X7R 型陶瓷介质，兼顾较高的容值与温度稳定性，适合对温度范围有中等要求的电源与去耦场合。X7R 的典型温度工作范围为 -55°C 至 +125°C。作为 50 V 额定电压元件，在直流偏置下电容值会随电压升高而下降，这是陶瓷介质的固有特性，设计时需考虑 DC-bias 影响并在实测条件下确认实际有效电容。
三、典型应用场景
- 汽车电子（车规级 ECU、传感器供电去耦）
- 电源输入/输出旁路与去耦（稳压器、DC-DC 转换器）
- 滤波与能量缓冲（中低频段）
- 工业控制与通信终端的高可靠性场合
四、封装与机械特性
0805（2012）封装尺寸小且厚度为 1.25 mm，便于在受限空间内实现较大容值布局。表面贴装工艺兼容标准回流焊流程，但因陶瓷器件对机械应力敏感，PCB 设计与焊接工艺需注意热冲击与弯曲应力以避免裂纹或寿命下降。
五、设计与使用建议
- 在关键车规应用中建议参考制造商的电压降额建议（对 DC-bias 敏感，应留有余量）。
- 布局时将此类去耦电容靠近 IC 电源引脚放置，以降低寄生感抗与回路面积。
- 回流焊温度曲线按三星推荐的热曲线执行，避免过长的高温暴露。
- 避免在装配或测试过程中对电容施加过大的弯曲或机械应力；使用适配的焊盘与过孔设计以降低裂纹风险。
六、质量与可靠性说明
该器件面向车规应用，生产与测试流程通常满足汽车电子对可靠性的更高要求（如抗振动、温度循环等）。如需确认证书（例如 AEC‑Q200 或具体可靠性数据、湿敏等级、焊接认证），建议向供应商索取最新的合格证书与可靠性报告，以便在整车或关键系统设计中进行合规性验证。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
