WMSIC Electronic Components

CL21B104KBFWPNE

ModelCL21B104KBFWPNE
Package0805
BrandSAMSUNG
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
SAMSUNG CL21B104KBFWPNE
Type
SAMSUNG
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SAMSUNG
Electronic Component
CL21B104KBFWPNE
Electronic Component
1
Electronic Component
100nF
Package
0805
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.034g
Electronic Component
1
Electronic Component
BM0264003569
Electronic Component
X7R
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
2000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CL21B104KBFWPNE 产品概述

1. 产品简介

CL21B104KBFWPNE 是一款由三星(SAMSUNG)生产的表面贴装多层陶瓷电容(MLCC),专为汽车级应用设计。该电容具有高可靠性和优异的电气性能,适用于各种严苛的汽车电子环境。

2. 关键参数

  • 电容值: 0.1µF (100nF)
  • 额定电压: 50V
  • 尺寸: 0.079" 长 x 0.049" 宽(2.00mm x 1.25mm)
  • 厚度(最大值): 0.053"(1.35mm)
  • 温度系数: X7R
  • 容差: ±10%
  • 工作温度范围: -55°C ~ 125°C
  • 等级: AEC-Q200
  • 特性: 开放模式

3. 应用领域

CL21B104KBFWPNE 主要应用于汽车电子系统,包括但不限于:

  • 发动机控制单元(ECU)
  • 车身控制模块(BCM)
  • 信息娱乐系统
  • 高级驾驶辅助系统(ADAS)
  • 传感器模块

4. 产品特点

  • 高可靠性: 符合AEC-Q200标准,确保在汽车环境中的长期稳定运行。
  • 优异的电气性能: X7R温度系数,提供稳定的电容值在宽温度范围内。
  • 紧凑尺寸: 0805封装(2.00mm x 1.25mm),适合高密度PCB设计。
  • 宽工作温度范围: -55°C ~ 125°C,适应各种极端环境。
  • 开放模式: 提供更好的散热性能和更高的可靠性。

5. 技术规格

  • 电容类型: 多层陶瓷电容(MLCC)
  • 封装: 0805(2012 公制)
  • 品牌: SAMSUNG(三星)
  • 等级: AEC-Q200
  • 温度系数: X7R
  • 容差: ±10%
  • 工作温度: -55°C ~ 125°C
  • 特性: 开放模式

6. 产品优势

  • 高可靠性: 符合汽车级标准,确保在严苛环境下的稳定运行。
  • 优异的电气性能: X7R温度系数,提供稳定的电容值在宽温度范围内。
  • 紧凑尺寸: 0805封装,适合高密度PCB设计。
  • 宽工作温度范围: -55°C ~ 125°C,适应各种极端环境。
  • 开放模式: 提供更好的散热性能和更高的可靠性。

7. 应用案例

  • 发动机控制单元(ECU): 用于滤波和去耦,确保信号的稳定传输。
  • 车身控制模块(BCM): 用于电源管理,提高系统的可靠性。
  • 信息娱乐系统: 用于信号处理,提升音视频质量。
  • 高级驾驶辅助系统(ADAS): 用于传感器信号处理,提高系统的响应速度。
  • 传感器模块: 用于信号滤波,提高传感器的精度。

8. 结论

CL21B104KBFWPNE 是一款高性能的汽车级多层陶瓷电容,具有高可靠性、优异的电气性能和紧凑的尺寸。其符合AEC-Q200标准,适用于各种严苛的汽车电子环境,是汽车电子系统中不可或缺的元件。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.