WMSIC Electronic Components

CL31B106KOHVPNE

ModelCL31B106KOHVPNE
Package1206
BrandSAMSUNG
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
SAMSUNG CL31B106KOHVPNE
Type
SAMSUNG
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SAMSUNG
Electronic Component
CL31B106KOHVPNE
Electronic Component
1
Electronic Component
10uF
Package
1206
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.074g
Electronic Component
1
Electronic Component
BM0264213502
Electronic Component
X7R
Voltage
16V
Electronic Component
Electronic Component
Electronic Component
2000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

三星CL31B106KOHVPNE 贴片陶瓷电容(MLCC)产品概述

一、产品核心身份与定位

CL31B106KOHVPNE是三星电子推出的通用型多层片式陶瓷电容(MLCC),针对中低电压、常规温度环境下的电子电路设计,平衡了容值稳定性、成本控制与可靠性,是消费电子、工业控制、通信设备等领域的主流选型器件。该型号属于三星CL31系列,主打高一致性与量产稳定性,适配多种PCB制造工艺。

二、关键技术参数详解

参数项 具体规格 关键说明 容值 10μF(标识“106”) 10×10⁶pF=10μF,满足中容量滤波、耦合的核心需求 精度 ±10%(K档) 常规电路精度要求,无需高精度NPO材质,兼顾成本与性能适配性 额定电压 16V DC 适配5V、12V等低压供电系统,避免过压导致的电容失效 温度系数 X7R 工作温度-55℃~+125℃,容值变化≤±15%,稳定性远优于Y5V等低成本材质 标识代码 106K “106”为容值编码(10×10⁶pF),“K”代表±10%精度

三、封装与物理特性

该型号采用1206英制封装(对应公制3216),符合IPC行业标准尺寸:

  • 长:3.2mm ±0.2mm
  • 宽:1.6mm ±0.2mm
  • 典型厚度:1.6mm(端电极突出部分不计)

端电极采用无铅镍锡镀层,适配回流焊、波峰焊工艺,焊接可靠性高;表面贴装设计无需PCB钻孔,节省空间且便于高密度布局,适合小型化电子设备。

四、材料与性能优势

  1. X7R材质核心价值:
    对比Y5V(温度/电压容值波动大)和NPO(高精度但成本高),X7R在-55℃~+125℃范围内容值波动≤±15%,16V电压下容值下降≤-10%,能稳定支撑滤波、去耦等需要固定容值的电路。
  2. MLCC固有特性:
    无极性设计(无需区分正负极)、高频响应优异(截止频率高)、寿命长(额定条件下≥10⁶小时)、体积小(容值密度是电解电容的数倍)。
  3. 三星制造优势:
    批量生产一致性好,参数偏差控制严格,减少电路设计中的性能波动;端电极镀层均匀,焊接后抗热冲击能力符合JEDEC标准。

五、典型应用场景

  1. 消费电子:手机、平板、笔记本的电源滤波(DC-DC输出端)、音频耦合、触控模块去耦;
  2. 工业控制:PLC、传感器节点、变频器的信号滤波、低压供电去耦;
  3. 通信设备:路由器、交换机、基站的电源模块滤波、射频电路耦合;
  4. 小家电:电磁炉、电饭煲、智能家电的控制电路滤波、时钟电路去耦。

六、可靠性与环境适应性

  • 工作环境:温度-55℃~+125℃,湿度≤85%RH(无凝露);
  • 存储环境:温度-40℃~+85℃,湿度≤75%RH;
  • 焊接兼容性:回流焊峰值温度260℃(10秒内),波峰焊245℃(5秒内);
  • 环保认证:符合RoHS 2.0、REACH标准,无铅、无镉、无溴,适配绿色制造要求。

七、选型与替代参考

若需替代或扩展选型,可参考同参数匹配型号:

  • 三星同系列:CL31B106KOHVPNE(同参数)、CL21B106KOHVPNE(低成本简化版);
  • 竞品型号:村田GRM188R61C106KA73D、TDK C1206X7R106K16AT、国巨CC1206KRX7RBBB106。

注意:替代时需确认封装、温度系数、电压等级完全匹配,避免电路性能下降或可靠性风险。

该型号凭借稳定的性能、成熟的工艺与广泛的适配性,成为电子设计中中容量滤波/去耦场景的高性价比选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.