WMSIC Electronic Components

CL10X475KO8NRNC

ModelCL10X475KO8NRNC
Package0603
BrandSAMSUNG
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
SAMSUNG CL10X475KO8NRNC
Type
SAMSUNG
Unit
Electronic Component
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
SAMSUNG
Electronic Component
CL10X475KO8NRNC
Electronic Component
1
Electronic Component
4.7uF
Package
0603
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.043g
Electronic Component
1
Electronic Component
BM0265062336
Electronic Component
X6S
Voltage
16V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

三星CL10X475KO8NRNC多层陶瓷电容器(MLCC)产品概述

一、产品核心身份与定位

三星CL10X475KO8NRNC是一款通用型多层陶瓷电容器(MLCC),隶属于三星电子MLCC标准化产品线,针对中低电压、中容值场景设计,主打小型化、宽温稳定、高性价比,广泛适配消费电子、小型通信设备等领域的基础电路需求。其料号编码中,“CL10X”为三星MLCC系列标识,“475”对应容值编码,“K”代表精度等级,整体定位为满足大众市场需求的高可靠性无源元件。

二、基础电气与物理参数解析

该型号参数完全遵循三星MLCC的标准化设计,核心指标如下:

  1. 容值与精度:标称容值4.7μF(即“475”编码:47×10⁵pF),精度等级±10%(标识“K”),适配大部分非高精度电路的滤波、耦合需求;
  2. 额定电压:直流(DC)额定电压16V,设计时建议实际工作电压不超过10V(留60%余量,保障长期可靠性);
  3. 温度特性:采用X6S温度系数,工作温度范围为-55℃~+105℃,此范围内容值变化率≤±22%,宽温环境下稳定性优异;
  4. 封装尺寸:0603英制封装(对应公制1608,长1.6mm×宽0.8mm),体积小巧,可有效节省PCB高密度布局空间;
  5. 端接与可靠性:镍/锡(Ni/Sn)端接,焊接兼容性强,通过JEDEC等行业可靠性测试(温度循环、湿度偏压等),寿命符合消费电子领域要求。

三、关键性能特性优势

  1. 宽温稳定性突出:X6S系数覆盖-55℃至+105℃,极端温度下容值波动小,可适配户外、车载低功耗场景;
  2. 小型化适配高密度设计:0603封装体积仅1.6×0.8×0.8mm(典型值),适合智能手机、智能穿戴等便携设备的紧凑电路;
  3. 低损耗与高频特性:具备低等效串联电阻(ESR)与低等效串联电感(ESL),100kHz~1GHz频段内损耗低,有效滤除高频噪声;
  4. 无极性与安装便捷:无需区分正负极,生产与维修时替换简单,降低电路设计复杂度;
  5. 高可靠性长寿命:三星成熟叠层工艺,陶瓷材料一致性好,避免长期使用中容值衰减或失效。

四、典型应用场景

该型号因参数均衡、成本可控,广泛应用于:

  1. 消费电子终端:智能手机/平板的电源滤波(电池管理系统BMS、充电电路)、信号耦合(音频、射频前端辅助滤波);
  2. 小型通信设备:路由器、无线耳机充电盒的电源模块滤波,保障信号传输稳定性;
  3. 小家电与智能硬件:遥控器、智能插座、小型智能家居设备的控制电路,实现电压稳定与噪声抑制;
  4. 工业控制辅助电路:低电压PLC模块、传感器节点的辅助滤波,适配-20℃~+85℃常规工业环境;
  5. 医疗便携设备:小型血糖仪、血压计等便携医疗设备的电路滤波,满足低功耗与宽温需求。

五、选型与应用注意事项

  1. 电压余量设计:实际工作电压需低于额定电压的80%(≤12.8V),避免过压导致容值衰减;
  2. 温度范围匹配:若场景温度超+105℃或低于-55℃,需更换X7R(-55~+125℃)型号;
  3. 焊接工艺要求:回流焊峰值温度控制在245℃±5℃,时间≤30秒,避免热应力导致陶瓷开裂;
  4. 精度适配:高精度滤波需求(如±5%)需选择J级精度型号,避免误差影响电路性能;
  5. 压电效应注意:高频大电流场景下可能产生轻微嗡嗡声,敏感场景可并联小容值MLCC缓解。

总结

三星CL10X475KO8NRNC作为通用型MLCC,以宽温稳定、小型化、高性价比为核心优势,覆盖多领域基础电路需求,是消费电子与小型设备设计的可靠选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.