Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品名称: CL21A106KQFNNNE
品牌: SAMSUNG(三星)
类型: 表面贴装多层陶瓷电容器 (MLCC)
封装: 0805(2012 公制)
CL21A106KQFNNNE是一款高性能的表面贴装多层陶瓷电容器,被广泛应用于各种电子设备中,尤其是在对空间和性能要求较高的应用场景。在其封装0805的尺寸中,该电容器的小巧设计使其非常适合在紧凑型电路中使用。
该产品的电容值为10µF,允许的容差为±10%,这保证了其在各种工作条件下能够保持良好的稳定性和可靠性。其额定电压为6.3V,适用于许多低压应用,确保在正常工作条件下不易打破。
CL21A106KQFNNNE采用X5R的温度系数,这意味着它的电容值在-55°C至85°C的温度范围内能够保持相对稳定。这种特性使其极具适应性,适合在各种环境中工作,尤其是在极端温度条件下。这种性能使得该电容器广泛应用于汽车电子、工业设备以及消费电子等领域。
该电容器在多个应用领域中展现了卓越的性能,特别是在以下几种应用中效果显著:
去耦电容: 在电源电路中,CL21A106KQFNNNE能有效过滤高频噪声,为敏感器件提供干净的电源供应。
滤波电容: 在音频设备和射频应用中,用作滤波电容,以减少电磁干扰,提高信号质量。
储能电容: 该电容器也可以用于一些储能应用,如储能电路中,因其高频特性能够提高能量效率。
信号耦合: 在信号处理电路中,能够有效地传输AC信号,同时阻挡DC成分。
作为一种表面贴装的电容器,CL21A106KQFNNNE兼容现代自动化焊接技术,便于集成到各类电路板中。其0805的封装尺寸,适合大部分PCB设计,能够实现高密度布局。无论是手工焊接还是机器自动化生产,这款电容器都表现出了良好的兼容性和适应性。
CL21A106KQFNNNE由SAMSUNG(三星)生产,结合了紧凑的设计、高性能和广泛的应用领域,使其成为电子产品设计中一个理想的选择。无论是一般电子设备、通信装置,还是汽车电子,CL21A106KQFNNNE都能提供可靠的电气性能和长久的使用寿命。
在选择电容器时,考虑到其优异的温度特性、低容差和高频性能,CL21A106KQFNNNE无疑是众多设计师和工程师的首选产品之一。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products