Model & package intelligence
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CL31B106KLHNNNE
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- SAMSUNG CL31B106KLHNNNE
- Type
- SAMSUNG
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SAMSUNG
- Electronic Component
- CL31B106KLHNNNE
- Electronic Component
- 1
- Electronic Component
- 10uF
- Package
- 1206
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.073g
- Electronic Component
- 1
- Electronic Component
- BM0259551713
- Electronic Component
- X7R
- Voltage
- 35V
- Electronic Component
- Electronic Component
- Electronic Component
- 2000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CL31B106KLHNNNE 产品概述
一、概述
CL31B106KLHNNNE 是三星（SAMSUNG）系列的一款多层陶瓷贴片电容器（MLCC），标称容量 10 µF，公差 ±10%，额定电压 35 V，介质类型 X7R，封装为 1206（3216 公制）。该型号面向对体积与容量有较高需求的表面贴装去耦、滤波和储能场合，兼顾体积效率与温度特性。
二、主要参数
- 容量：10 µF
- 精度：±10%（K）
- 额定电压：35 V
- 介质：X7R（温度范围通常为 -55°C 到 +125°C）
- 封装：1206（公制 3216，约 3.2 × 1.6 mm）
- 品牌：SAMSUNG
三、性能与特性
- 高体积比：在 1206 尺寸下提供较大的电容量，适合空间受限但需中等容量的电源布置。
- 温度特性：X7R 介质能在宽温区间工作（-55°C 至 +125°C），但陶瓷类二类介质本身会有随温度和时间的容量漂移。
- 直流偏置效应：在高静态电压下实际有效电容会下降，设计时建议考虑 DC-bias 曲线并适当留有裕度。
- 低等效串联电阻（ESR）和低电感，适合高频去耦与旁路应用。
四、典型应用
- 电源去耦与旁路（DC-DC 转换器输入/输出、电源总线稳压）
- 电源滤波与储能（中小功率域）
- 通信设备、消费电子、工业控制等需要稳定中等容量的电路板设计
五、使用与选型建议
- 考察 DC-bias 曲线：在靠近额定电压工作时，关注实际容量随电压下降的比例，必要时选择更高额定电压或更大容量型号以保证功能裕度。
- 温度与老化：X7R 会有随温度和使用时间的容量变化，关键电路应预留余量并参考厂商曲线。
- 焊接与可靠性：建议按制造商推荐的回流焊工艺进行贴装，避免机械应力集中；考虑震动、热循环等环境时进行可靠性验证。
- 封装选择：1206 在手工贴装与自动化贴装中均常用，注意焊盘设计以减少应力和保证焊接质量。
六、包装与采购
CL31B106KLHNNNE 常见以卷带（tape-and-reel）形式供应，便于 SMT 生产线贴片使用。订购时请以完整料号确认电气参数、温度/电压曲线与包装规格，并参阅三星官方数据手册获取详细可靠性与试验数据。
以上为基于给定参数的产品概述。更多电气特性曲线（DC-bias、频率响应、温度系数、寿命与可靠性试验结果）以及尺寸详图，请参考三星原厂数据手册或向供应商索取样片进行验证。
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