WMSIC Electronic Components

CL05A475KP5NRNC

ModelCL05A475KP5NRNC
Package0402
BrandSAMSUNG
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
SAMSUNG CL05A475KP5NRNC
Type
SAMSUNG
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SAMSUNG
Electronic Component
CL05A475KP5NRNC
Electronic Component
1
Electronic Component
4.7uF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.013g
Electronic Component
1
Electronic Component
BM0000001270
Electronic Component
X5R
Voltage
10V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:CL05A475KP5NRNC

一、产品简介

CL05A475KP5NRNC是三星(SAMSUNG)公司生产的一款表面贴装多层陶瓷电容(MLCC),其封装尺寸为0402(1.00mm x 0.50mm),适用于各种通用电路应用。该电容器在现代电子设备中扮演着至关重要的角色,常用于滤波、耦合、旁路和去耦合等功能,是近年来广泛应用的被动组件之一。

二、技术参数

  1. 容量: 4.7µF
  2. 额定电压: 10V
  3. 容差: ±10%
  4. 温度范围: -55°C至85°C
  5. 温度系数: X5R
  6. 封装类型: 0402
  7. 最大厚度: 0.022"(0.55mm)

三、封装规格

0402封装是指电容器的尺寸为0.039"长和0.020"宽(即1.00mm x 0.50mm),非常适合高密度表面贴装技术(SMT)应用。其小巧的尺寸使得在空间有限的电子产品中,能够有效节省PCB设计空间,满足现代电子产品日益增加的集成度要求。

四、应用领域

CL05A475KP5NRNC广泛应用于以下领域:

  • 消费电子:如智能手机、平板电脑、笔记本电脑等,主要用于去耦和滤波。
  • 通讯设备:如路由器、交换机等,通过旁路电容提供稳定的电源。
  • 汽车电子:在车载电子设备中提高信号的稳定性和可靠性。
  • 工业设备:在各种传感器和控制器中,发挥电去耦和信号滤波的作用。

五、元件特点

  1. 优良的稳定性:由于其X5R的温度系数,CL05A475KP5NRNC在不同温度范围内具有较好的电容稳定性,确保在多变的工作环境中保持性能一致。
  2. 低等效串联电阻(ESR):低ESR特性使其在高频性能上表现出色,适用于高压和高频信号应用。
  3. 耐高压能力:额定电压为10V,适合大多数低压电源系统,确保安全操作。
  4. 多样的适用性:该电容可广泛应用于各种电路,增强其多功能性。

六、使用注意事项

  • 焊接注意:在进行表面贴装时,需要确保焊接温度和时间符合品牌推荐的规范,以避免损坏电容器的内部结构。
  • 电压选择:在应用时,电压要控制在额定电压以下,以确保电容的长久稳定性和可靠性。
  • 温度考虑:虽然CL05A475KP5NRNC的工作温度范围为-55°C至85°C,但在极端环境下使用时,仍需评估其性能表现。

七、总结

综上所述,CL05A475KP5NRNC是一款由三星生产的高品质表面贴装多层陶瓷电容,具有优良的电气性能和广泛的应用场合。其符合现代电子产品对小型化、高性能的需求,是科研、工业、消费电子等领域不可或缺的重要组件之一。在选择和应用该产品时,了解其特性和工作条件将有助于实现最佳的电路设计和性能表现。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.