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CL21B102KBANNNC
Configuration
1 options
Configuration
Electronic Component
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- SAMSUNG CL21B102KBANNNC
- Type
- SAMSUNG
- Unit
- Electronic Component
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- SAMSUNG
- Electronic Component
- CL21B102KBANNNC
- Electronic Component
- 1
- Electronic Component
- 1nF
- Package
- 0805
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.034g
- Electronic Component
- 1
- Electronic Component
- BM0257642187
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：CL21B102KBANNNC
基本信息
CL21B102KBANNNC是由三星（SAMSUNG）制造的一款高性能表面贴装多层陶瓷电容器（MLCC），其电容量为1000pF（1nF），额定电压为50V，采用X7R温度系数材料，适用于多种电子应用。该产品的封装尺寸为0805（即2.00mm x 1.25mm），其设计紧凑，便于与现代电子设备的基板相兼容。
电气特性
- 电容量：CL21B102KBANNNC具有1000pF的电容量，足以满足大多数通用电路的去耦和滤波需求。
- 容差：此电容器的容差为±10%，确保在各种工作条件下依然能够稳定运行，适应不同的电路设计需求。
- 额定电压：该电容额定电压为50V，确保其在高电压环境中的可靠性，适用于多种工业和消费者电子应用中。
- 温度系数：X7R温度系数材料能在-55°C到125°C的宽温度范围内工作，且其电容值变化较小，即使在极端温度条件下也保持较好的稳定性。
机械特性
- 封装类型：CL21B102KBANNNC采用0805（2012公制）封装， size 为0.079"长 x 0.049"宽（2.00mm x 1.25mm），厚度最大为0.030"（0.75mm）。这种小型化设计使其非常适合于现代电子设备，尤其是在空间受限的场合。
- 安装类型：作为表面贴装元器件，它能够快速方便地安装在印刷电路板（PCB）上，适合自动化生产线，提升了生产效率。在所有文档中，表面贴装技术（SMT）已成为现代电子设备中普遍采用的元器件安装方式。
应用领域
CL21B102KBANNNC的广泛应用领域包括：
- 消费电子：如智能手机、平板电脑、笔记本电脑等设备的电源管理和信号去耦。
- 工业控制：电子仪器设备中，用于信号耦合、去耦和滤波，保证系统的稳定性和可靠性。
- 汽车电子：在发动机控制单元（ECU）、传感器和通信设备中，提供很好的EMI（电磁干扰）抑制和电源稳定。
- 医疗设备：在要求严格的医疗设备中，保证高可靠性和长期稳定的工作表现。
结论
总之，CL21B102KBANNNC是一款高性能的多层陶瓷电容器，拥有出色的电气特性和机械特性，广泛适用于各类电子产品。其广泛的工作温度范围和高额定电压，使其在严苛环境下仍能保持稳定性能。作为三星的一款优质产品，CL21B102KBANNNC不仅满足了当前市场对小型化和高性能的需求，也为电子设计师在电路设计上提供了有效的解决方案。
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