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CL10C102JB8NFNC
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- SAMSUNG CL10C102JB8NFNC
- Type
- SAMSUNG
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SAMSUNG
- Electronic Component
- CL10C102JB8NFNC
- Electronic Component
- 1
- Electronic Component
- 1nF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.035g
- Electronic Component
- 1
- Electronic Component
- BM0257172293
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CL10C102JB8NFNC 产品概述
一、产品简介
CL10C102JB8NFNC 是三星（SAMSUNG）生产的一款多层陶瓷电容（MLCC），标称容值 1 nF（1000 pF），公差 ±5%（J），额定电压 50 V，介质类型为 C0G/NP0，封装为 0603（公制 1608）。该型号以温度稳定性高、损耗低和高可靠性著称，适合对精度与稳定性有较高要求的电路。
二、主要参数
- 容值：1 nF（1000 pF）
- 公差：±5%（J）
- 额定电压：50 V DC
- 介质：C0G / NP0（温度系数接近 0 ppm/°C）
- 封装：0603（1608，约 1.6 mm × 0.8 mm）
- 品牌：SAMSUNG
三、关键特性
- 温度特性极佳：C0G/NP0 介质在宽温区间内电容值变化极小，适合高精度定时、滤波与振荡回路。
- 低介质损耗：低损耗（低 DF），提高信号完整性并降低自发热。
- 稳定性与可重复性：随时间与偏压变化小，长期漂移极小，适合高可靠性应用。
- 小封装、高密度：0603 封装兼顾体积与机器贴装可制造性，适用于空间受限的现代电路板。
四、典型应用场景
- 精密振荡器与时钟电路（RC 振荡、载波稳定）
- 模拟前端与 ADC 采样网络（采样保持、滤波）
- 高频滤波与匹配网络（低损耗要求的 RF/IF 应用）
- 工业、医疗及仪表级别的精密测量电路
五、封装与可靠性考虑
0603 小封装便于高密度贴片，但对焊接应力与 PCB 弯曲敏感。C0G 型 MLCC 通常工作温度范围广（典型 -55°C 到 +125°C），并能承受常规回流焊工艺。实际可靠性与湿敏级别、包装卷带状态应依赖厂商数据表确认。
六、使用与焊接建议
- 遵循制造商推荐的回流焊温度曲线（常见峰值约 250–260°C）并控制升温速率以减少热应力。
- 设计 PCB 焊盘时考虑适当焊盘延伸与对称性，减小热不均与机械应力。
- 避免在装配或使用过程中对元件施加弯曲或机械冲击；必要时可在布局上增加应力缓冲区。
- 虽然 C0G 对偏压效应非常小，但在高电压或特殊频段应用前仍建议进行电气验证。
七、选型与替代建议
选择时应核对实际工作电压、环境温度、封装兼容性和可靠性要求。若需要更高电压或更小封装，可查找同厂或其他厂商的等效 NP0/C0G 产品；若容差或温漂要求放宽，可考虑 X7R 等更高容值密度的介质以节省空间和成本。
八、总结
CL10C102JB8NFNC 为一款性能稳定、温漂极小的 1 nF ±5% 50 V C0G 陶瓷电容，适用于对精度、低损耗与长期稳定性有较高要求的模拟与射频电路。在实际设计和生产中，建议参照三星官方数据手册核实详细电气与封装规范，并按照推荐的焊接与储存规范操作，以确保元件的可靠性与性能满足系统需求。
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