Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
CL32A227MQVNNNE
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- SAMSUNG CL32A227MQVNNNE
- Type
- SAMSUNG
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SAMSUNG
- Electronic Component
- CL32A227MQVNNNE
- Electronic Component
- 1
- Electronic Component
- 220uF
- Package
- 1210
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±20%
- Electronic Component
- 0.182g
- Electronic Component
- 1
- Electronic Component
- BM0061982091
- Electronic Component
- X5R
- Voltage
- 6.3V
- Electronic Component
- Electronic Component
- Electronic Component
- 1000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：CL32A227MQVNNNE
产品名称： CL32A227MQVNNNE
品牌： SAMSUNG（三星）
包装类型： 1210（3225 公制）
安装类型： 表面贴装
基本规格：
- 电容值: 220µF
- 容差: ±20%
- 额定电压: 6.3V
- 电容类型: 多层陶瓷电容（MLCC）
- 温度特性: X5R
- 工作温度范围: -55°C 至 85°C
- 封装尺寸: 0.126" x 0.098"（3.20mm x 2.50mm）
- 最大厚度: 0.110"（2.80mm）
1. 概述
CL32A227MQVNNNE 是三星制造的一款高性能多层陶瓷电容（MLCC），适用于各种通用电子应用。该电容器采用表面贴装技术，尺寸为1210（3225公制），适合高密度组装，并能够满足现代小型化电路设计的需求。其额定电压为6.3V，电容值为220µF，容差为±20%，使其在不同工作条件下表现出良好的电性能与可靠性。
2. 应用领域
CL32A227MQVNNNE广泛应用于多种电子设备中，包括但不限于：
- 消费电子：如智能手机、平板电脑和便携式音频设备等。
- 工业设备：在自动化控制系统及传感器中起到去耦和滤波作用。
- 计算机及网络设备：在主板、图形卡及网络设备中提供稳定的电源管理。
- 汽车电子：高温和低温工作环境中均能良好运行，适合汽车电路中对电容稳定性和耐久性的要求。
3. 关键特性
- 高电容密度：220µF的电容值和小型封装设计，使得在电路板上不占用过多空间，满足对电容体积及电容量的双重要求。
- 宽温工作范围：-55°C 至 85°C的工作温度范围保证了此电容器在各种极端环境下的稳定性能，适合温度变化较大的应用环境。
- 优越的温度特性：X5R温度特性使得电容在一定温度范围内能保持相对稳定的电容值，适用于大多数电压条件和环境变化。
- 优良的ESR和 ESL特性：由于其多层设计，CL32A227MQVNNNE展现出低等效串联电阻(ESR)和电感(ESL)，改善了交流特性，减少信号失真。
4. 设计注意事项
- 焊接技术：由于其表面贴装特性，在PCB上焊接时需要注意回流焊接温度和时间，确保电容器焊接不产生热损坏。
- 电压 derating：在实际设计中，建议将工作电压设定在额定电压的70%至80%之内，以延长产品的使用寿命和可靠性。
- 环境因素：在高温和高湿度环境下，需确保电容器周围空间通风良好，以防止过热及水分积聚对性能的影响。
5. 总结
CL32A227MQVNNNE作为一款三星制造的高性能贴片电容，凭借其高电容量、宽工作温度范围及出色的温度稳定性，成为现代电子产品设计中不可或缺的组件之一。它不仅满足了多领域的电气性能需求，同时也为小型电子设备提供了更灵活的设计空间，助力工程师在各类应用中实现更多创新与可能。选择CL32A227MQVNNNE，您将获得可靠的电源解决方案，提升产品的整体性能与稳定性。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
