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CL10X106MQ8NNNC
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- SAMSUNG CL10X106MQ8NNNC
- Type
- SAMSUNG
- Unit
- Electronic Component
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- SAMSUNG
- Electronic Component
- CL10X106MQ8NNNC
- Electronic Component
- 1
- Electronic Component
- 10uF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±20%
- Electronic Component
- 0.035g
- Electronic Component
- 1
- Electronic Component
- BM0257689107
- Electronic Component
- X6S
- Voltage
- 6.3V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CL10X106MQ8NNNC 产品概述（SAMSUNG 0603 10µF X6S 6.3V）
一、产品简介
CL10X106MQ8NNNC 为三星（SAMSUNG）生产的多层陶瓷贴片电容（MLCC），标称容量 10µF，公差 ±20%，额定电压 6.3V，温度特性 X6S，封装规格 0603（公制 1608）。该型号专为对体积、频率响应与可靠性有要求的移动与便携电子产品电源滤波、去耦与储能场合设计。
二、主要特性
- 高容量密度：在 0603 小封装中实现 10µF，利于 PCB 布局小型化。
- 工作电压：额定 6.3V，适配低压电源轨（如 1.8V/2.5V/3.3V）旁路与退耦。
- 温度稳定性：X6S 温度特性可覆盖较宽温度范围，适合工业级或车规以外的宽温环境。
- 良好频率响应与低 ESL：适用于开关电源输出与高速数字电路的瞬态补偿。
- SMT 贴片工艺兼容：支持常规回流焊工艺，适配自动化贴装与高速量产。
三、典型应用
- 智能手机、平板与可穿戴设备的电源去耦与稳定
- DC-DC 升降压转换器的输出端滤波
- 无线通信模组、IoT 终端电源旁路
- 各类消费电子与便携式设备中要求小体积高容量的场合
四、使用注意事项
- DC 偏压与温度影响：高介电常数陶瓷在施加直流偏压或升温时容值可能下降，设计时应考虑直流偏压特性与在工作温度下的有效容量。
- 老化与恢复：某些介质存在随时间的容量衰减（老化）现象，通过高温回流或热处理可部分恢复，建议在关键应用中进行可靠性评估。
- 机械应力敏感：贴装和焊接过程应避免在焊盘或元件附近施加机械应力，防止裂纹导致失效。PCB 设计时注意避免过窄焊盘、避免孔位紧邻元件。
- 焊接工艺：推荐采用标准回流温度曲线，遵循厂商焊接指南；如需清洗或超声洗板，应先与制造商确认，以免产生微裂影响寿命。
- 储存与搬运：按常规 SMT 元件要求防潮、防静电；若长期存放于极端环境，则应进行前焊烘烤处理。
五、封装与采购建议
CL10X106MQ8NNNC 通常以卷带（reel）形式供应，适配自动贴片机。选型时建议依据实际工作电压、温度与空间限制比对 DC 偏压下的实际容量，并在关键电源回路上预留容量裕度或并联低 ESR 电解/钽电容以补充低频能量需求。
六、质量与可靠性
作为三星系列 MLCC，具有良好的批次一致性和工艺控制。实际项目导入前建议做温度循环、湿热、振动与寿命加速测试，以验证在目标应用环境下的性能稳定性与老化情况。
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