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CL31B105KBHNNNE 是一款由三星(SAMSUNG)生产的表面贴装陶瓷电容器(MLCC),其基本参数如下:
CL31B105KBHNNNE 延续了三星在电子元器件领域的优质标准,是一款设计合理、性能可靠的贴片陶瓷电容器。其设计具有以下几方面的突出特点:
卓越的电气性能: 作为一款1µF的电容器,CL31B105KBHNNNE 具有良好的频率特性,相对较低的等效串联电阻(ESR)和等效串联电感(ESL),适合于高频应用。这种电容器特别适合在滤波、耦合和去耦等应用中使用,能够有效提高电路的稳定性和响应速度。
广泛的工作温度范围: CL31B105KBHNNNE 的工作温度范围扩展至 -55°C 至 125°C,这使得它在苛刻环境条件下的应用更加广泛。该电容器可适用于汽车电子、工业控制、医疗设备及消费类电子等领域。
高可靠性: 采用X7R温度系数材料使得电容器在一定的温度范围内保持相对稳定的电容值。这种材料特性意味着产品在不同环境下运行时,能够提供一致性和稳定性,符合各类严苛的行业标准。
紧凑的封装: 1206的封装尺寸(3.20mm x 1.60mm)使得该电容器在组件密集的电路设计中表现出色。其小巧的体积能够有效节省PCB空间,并满足现代电子设备对小型化、轻量化的要求。
易于安装: 表面贴装技术(SMD)的设计使得CL31B105KBHNNNE易于自动化装配,提供高通量的生产效率,并降低生产成本。同时,贴片电容器的安装通常具有更好的抗震性能,适合于高可靠性的应用场景。
CL31B105KBHNNNE 的多种特性使得其适用于多种应用场合,包括但不限于:
总的来说,CL31B105KBHNNNE 是一款在技术、性能和应用方面都表现优异的贴片电容器。作为三星品牌的代表产品之一,它不仅具备先进的材料和技术,且在突出的电气性能与优良的环境适应性之间达成了良好的平衡,适合各种高规格的电子产品需求。对于设计人员而言,选用CL31B105KBHNNNE 作为电路中的电容器,将能够大幅提升整体设计的可靠性与性能表现。
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WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
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The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
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The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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