Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
CL10C471JB8NNNC
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- SAMSUNG CL10C471JB8NNNC
- Type
- SAMSUNG
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SAMSUNG
- Electronic Component
- CL10C471JB8NNNC
- Electronic Component
- 1
- Electronic Component
- 470pF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.035g
- Electronic Component
- 1
- Electronic Component
- BM69414182
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：CL10C471JB8NNNC 贴片电容（MLCC）
一、产品简介
CL10C471JB8NNNC 是三星（SAMSUNG）公司生产的一款高性能多层陶瓷电容器（MLCC），其电容值为470pF，额定电压为50V，容差为±5%。该电容器采用0603表面贴装封装（1608公制），非常适用于现代电子电路设计中的空间限制和高性能需求。
二、技术参数
- 电容: 470pF
- 容差: ±5%
- 额定电压: 50V
- 温度系数: C0G（NP0）
- 工作温度范围: -55°C ~ 125°C
- 封装类型: 0603（表面贴装）
- 尺寸: 1.60mm x 0.80mm x 0.90mm（长 x 宽 x 高）
三、产品特性
CL10C471JB8NNNC 的C0G/NP0温度系数表明其电容值在整个操作温度范围内线性变化，表现出优良的稳定性和可靠性。与其他电容类型相比，C0G电容具有极低的温度漂移和电压漂移特性，非常适合用于高精度和高稳定性的应用场合。此外，其良好的耐高温性和广泛的工作温度范围使得该电容器可在各种恶劣环境下稳定工作。
四、应用场景
CL10C471JB8NNNC 适用于广泛的电子应用，从消费电子到工业设备。常见的应用场景包括但不限于：
- 射频电路: 在射频信号通路中，470pF的电容值适用于匹配和谐振电路，以确保信号的有效传输和减少信号丢失。
- 滤波器: 在音频和视频设备中，使用该电容器作为滤波器元件，可以帮助消除噪声，并优化信号质量。
- 耦合和去耦电路: 应用在耦合和去耦电路中，可以有效地隔离不同电路部分之间的干扰。
- 调谐电路: 适用于无线电收发器和震荡电路中，帮助实现调谐功能。
- 自动化设备: 在各种传感器和控制系统的应用中，具有优良性能的电容器能够保证设备稳定运行。
五、竞争优势
- 品牌优势: 作为知名电子元器件制造商，三星在质量控制和技术创新方面处于领先地位，客户可以获得高质量和高可靠性的产品保证。
- 尺寸小巧: 0603封装的设计使得该电容在空间受限的应用中表现出色，能够有效减少电路板的占用面积。
- 高稳定性: C0G温度系数带来的优越电容稳定性，使得该电容在温度变化异较大的环境中维持良好的性能。
- 全能应用: 适用范围广泛，涵盖了通讯、消费电子、医疗设备、工业控制等多个领域。
六、总结
CL10C471JB8NNNC 贴片电容器以其470pF的电容值、±5%的容差和50V的额定电压，结合卓越的C0G温度特性，成为现代电子设计中不可或缺的元器件之一。无论在消费电子、通信设备还是工业自动化中，该电容器都展现出卓越的性能和广泛的应用适应性，能够为高精度和高稳定性电路提供可靠的解决方案。
选择三星的CL10C471JB8NNNC电容器，您将获得先进技术和优质保障，为您的电子产品设计提供强大的支持。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece Integrated Circuit for IRS20124S IRS21956S SOP-20 IRS2453DS SOP-14
- Model
- IRS20124S
- Package
