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CL31A106KOHNNNE
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- SAMSUNG CL31A106KOHNNNE
- Type
- SAMSUNG
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SAMSUNG
- Electronic Component
- CL31A106KOHNNNE
- Electronic Component
- 1
- Electronic Component
- 10uF
- Package
- 1206
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.074g
- Electronic Component
- 1
- Electronic Component
- BM0000001255
- Electronic Component
- X5R
- Voltage
- 16V
- Electronic Component
- Electronic Component
- Electronic Component
- 2000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：CL31A106KOHNNNE（SAMSUNG 16V 10µF X5R MLCC）
CL31A106KOHNNNE是由SAMSUNG（三星）公司推出的一款多层陶瓷电容器（MLCC），其设计和制造旨在满足现代电子设备对高性能和可靠性的需求。此电容器具有优异的电气性能和广泛的应用场景，非常适合多个行业的电子产品，包括消费电子、工业设备、电源管理模块等。
基础参数
- 厚度（最大值）： 0.071"（1.80mm）
- 安装类型： 表面贴装，MLCC
- 额定电压： 16V
- 容差： ±10%
- 尺寸： 0.126" x 0.063"（3.20mm x 1.60mm）
- 电容值： 10µF
- 应用： 通用
- 工作温度范围： -55°C ~ 85°C
- 温度系数： X5R
- 封装类型： 1206
设计与性能
CL31A106KOHNNNE采纳了X5R温度特性，这意味着电容器在从-55°C到85°C的温度范围内保持相对稳定的电容值。这使得该电容器非常适合高温和低温应用环境，能够在各种苛刻条件下工作而不影响其性能。它的电容值为10µF，结合16V的额定电压，为处理一些电源滤波、耦合和旁路应用提供了极大的灵活性。
多层陶瓷电容器因其较低的等效串联电阻（ESR）和高频响应而闻名，尤其适用于需要快速充放电的应用。这使得CL31A106KOHNNNE成为高频电路、开关电源和无线通信设备等现代设备的理想选择。
应用场景
CL31A106KOHNNNE适用于多个电子应用。由于其通用性和优秀的性能，这款电容器广泛应用于以下领域：
消费电子：智能手机、平板电脑、笔记本电脑等设备中，常用于电源管理和信号处理。
工业设备：在PLC（可编程逻辑控制器）和各种工业控制系统中，作为滤波器和旁路电容，确保系统的稳定性。
汽车电子：随着汽车电子技术的发展，该电容器可用于电动助力转向系统、音响系统及车载信息娱乐系统中，提高系统的抗干扰能力和性能。
医疗设备：在医疗设备的电源管理和信号处理上使用，可以增加设备的准确性和可靠性，确保患者安全。
安装与兼容性
CL31A106KOHNNNE采用表面贴装技术（SMT），这一特性确保了它与现代自动化生产线的兼容性，可大幅提高安装效率。由于其小巧的1206封装尺寸（3.20mm x 1.60mm），该电容器在减小PCB布局尺寸方面表现出色，适应了密集型电子设计的需求。
结论
总体而言，CL31A106KOHNNNE是一款性能优越的多层陶瓷电容器，凭借其高电容值、低ESR及宽广的工作温度范围，提供了极强的适应性和可靠性。无论是在新产品开发还是在现有产品升级中，SAMSUNG的这一产品都是值得信赖的选择，能够有效提升电子设备的性能并满足现代电路设计的严苛要求。
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