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CL21X106KAYNNNE
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- SAMSUNG CL21X106KAYNNNE
- Type
- SAMSUNG
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SAMSUNG
- Electronic Component
- CL21X106KAYNNNE
- Electronic Component
- 1
- Electronic Component
- 10uF
- Package
- 0805
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.034g
- Electronic Component
- 1
- Electronic Component
- BM0265916340
- Electronic Component
- X6S
- Voltage
- 25V
- Electronic Component
- Electronic Component
- Electronic Component
- 2000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：CL21X106KAYNNNE
1. 产品简介
CL21X106KAYNNNE 是一款由三星(SAMSUNG)生产的高性能表面贴装陶瓷电容器（MLCC），其电气特性和尺寸规范为现代电子设备设计提供了广泛的应用可能。该电容器具有额定电压为25V，电容量为10µF，容差为±10%等特性，且适用于宽广的工作温度范围（-55°C ~ 105°C）。其0805（2012 公制）封装设计，使得该设备在各种电子电路中能够实现高度的集成与小型化。
2. 关键参数
- 安装类型：表面贴装（SMD），这意味着该电容器可以直接焊接到印刷电路板（PCB）表面，简化了生产流程和提升了电路的整体性能。
- 电容值：10µF，适合用于滤波、去耦或储能应用，能有效提高电路的稳定性和性能。
- 额定电压：25V，意味着在该电压下可以安全地进行工作，适合于一些低功耗的数字电路。
- 容差：±10%，为电路设计提供了良好的弹性，保证了电路的可用性和可靠性。
- 温度系数：X6S，指的是电容在-55°C到105°C之间的电容量变化不超过±15%，适应了多变的温度环境。
- 封装尺寸：0805（2012 公制），此尺寸设计适合小型化电子产品及对面积要求严格的应用场合。
3. 应用场景
CL21X106KAYNNNE 主要用于现代电子设备，例如：
- 消费电子：如智能手机、平板电脑和笔记本电脑：在这些设备中，电容器通常被用于滤波和去耦，以确保稳定的电源供应和信号完整性。
- 通信设备：如路由器和基站等需要高频信号传输的设备中，该电容器可以有效提高电路稳定性及抗干扰性。
- 汽车电子：现代汽车电子系统对电气稳定性要求极高，该电容器能在极端工作温度下仍然保持优异的性能。
- 工业设备：应用于传感器和自动化设备中，以提供必要的去耦和噪声滤波。
4. 性能优势
- 高可靠性：该系列产品在制定的工作温度范围内具有出色的性能，增强了可靠性，减少了因温度波动导致的故障风险。
- 小型化设计：0805封装的设计使其能够在小型化的电路设计中占据更小的空间，对于追求体积和性能平衡的现代电子设备设计师来说尤为重要。
- 优良的电气特性：包括低失真、低内部电阻，确保高频信号的传输质量，满足了高速度工作的消费电子设备的需求。
5. 结论
CL21X106KAYNNNE 是一款综合性能优越的表面贴装陶瓷电容器，能够满足多种电子应用的需求。凭借其小巧的封装、高可靠性及多种应用场景的适用性，这款电容器为设计师提供了更多的创新空间，并助力其开发出更加高效、稳定的电子产品。作为现代电子设计中不可或缺的元件，CL21X106KAYNNNE 将继续在各个领域发挥重要作用。
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