WMSIC Electronic Components

CL31B225KBHNNNE

ModelCL31B225KBHNNNE
Package1206
BrandSAMSUNG
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
SAMSUNG CL31B225KBHNNNE
Type
SAMSUNG
Unit
Electronic Component
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
SAMSUNG
Electronic Component
CL31B225KBHNNNE
Electronic Component
1
Electronic Component
2.2uF
Package
1206
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.074g
Electronic Component
1
Electronic Component
BM0000004162
Electronic Component
X7R
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
2000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:CL31B225KBHNNNE 贴片电容

1. 产品简介

CL31B225KBHNNNE 是由三星(SAMSUNG)生产的一款高性能多层陶瓷电容(MLCC),其电气参数和结构设计使其成为电子应用中不可或缺的元器件。这款电容具有2.2µF的容值,并且额定电压为50V,符合现代电子设备对高性能、高可靠性的要求。

2. 技术参数

  • 电容值:2.2µF(微法拉)
  • 容差:±10%,在制造过程中提供良好的一致性和可靠性
  • 额定电压:50V,适合在高电压环境下工作
  • 温度系数:X7R,确保在宽温范围内保持电容性能的稳定
  • 工作温度范围:-55°C ~ 125°C,适应各种严苛的工作环境
  • 安装类型:表面贴装(SMT),便于现代PCB的自动装配
  • 封装类型:1206(3216公制),紧凑的尺寸便于在空间有限的电路板上使用
  • 最大厚度:0.071"(1.80mm),有助于降低整体系统的高度

3. 应用领域

CL31B225KBHNNNE 贴片电容广泛应用于各种电子设备,包括但不限于:

  • 消费电子:如智能手机、平板电脑、电视和音频设备
  • 工业设备:如PLC控制器、传感器、监控系统
  • 汽车电子:适用于车载娱乐、导航系统、电动汽车控制单元等
  • 通信设备:路由器、交换机以及无线通信基站等

4. 性能优势

  • 高可靠性:由于采用优质的陶瓷材料和严格的制造工艺,CL31B225KBHNNNE 电容具备优良的长期稳定性和抗电压冲击能力。
  • 良好的温度特性:X7R温度系数保证了电容器在宽温范围内的电容值变化微小,适应各种环境变化。
  • 适合高密度电路设计:1206封装尺寸使其适合高密度电路设计,能够有效节省PCB面积极,提高产品的小型化。
  • 低ESR和ESL:此电容具有低等效串联电阻(ESR)和低等效串联电感(ESL),使其在高频应用中表现优异。

5. 使用注意事项

在实际应用中,使用CL31B225KBHNNNE时,需注意以下几点:

  • 电压 derating:建议的工作电压不应超过额定电压的70%至80%,可大幅提升电容的使用寿命。
  • 温度影响:在高温环境下,应注意温度对电容值的影响,尽量选择适合的工作条件。
  • PCB设计考虑:在设计PCB时,适当安排铜箔的宽度和散热条件,可以有效改善电容的工作性能。

6. 结论

CL31B225KBHNNNE 贴片电容以其优异的电气性能和可靠的制造工艺,广泛适用于现代电子设备中。无论是在消费类电子产品、工业控制设备、汽车电子还是通信器材中,它都表现出色,能够满足各种严苛的工作环境及性能要求。作为一款高质量的贴片电容,三星的这款产品无疑是提升电子设备性能的理想选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.