Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述: CL05B104KP5NNNC 贴片电容
一、基础信息概览
CL05B104KP5NNNC是由韩国知名电子元器件制造商三星(SAMSUNG)出品的一款多层陶瓷电容器(MLCC)。该电容的包装采用0402封装,符合表面贴装(SMD)标准,广泛应用于现代电子设备中的各种电路中,以提供稳定的电容值和可靠的性能。
二、主要参数
三、特性与优点
CL05B104KP5NNNC的主要特点包括其优越的温度和电压性能。作为一种X7R温度系数的电容器,该产品可在宽广的工作温度范围内保持其电容值,适合高温环境以及低温情况的应用。这使得它在汽车电子、工业控制、消费电子和通信设备中具有极高的实用价值。
小型0402封装使得该电容在有限的PCB空间中得到广泛应用,尤其是在高密度的电路布局中,厂家需要在提高设备功能的同时又能保持小巧的外形。CL05B104KP5NNNC的低厚度设计确保其在紧凑空间内的兼容性,无论是移动设备还是静态设备均可方便集成。
四、应用场景
考虑到其10V的耐压范围,这款电容适合多种场合。一般而言,贴片电容通常用于滤波、耦合、去耦合及旁路等电路中。在消费电子领域,CL05B104KP5NNNC可以用于电源管理,确保持久的电压稳定。此外,在射频和信号处理电路中,此电容能有效降低噪声,提高信号质量。
在汽车工业中,这款电容器因其高温耐受性也受到青睐,可用于发动机控制单元、车载信息娱乐系统等区域。其良好的长期稳定性和市场的成熟应用使之成为许多工程师和设计师的首选。
五、性能稳定性
CL05B104KP5NNNC的耐热性及其极好的电气特性使得其在严格的工业环境下也能保持高效运行。通过其可靠的技术规格,该电容不仅能够抵御电压波动,还能有效承受电流的瞬态变化。多个应用环境下的严格测试证明该电容在性能稳定性和寿命方面表现出色。
六、总结
CL05B104KP5NNNC以其卓越的电气性能、紧凑的封装设计和广泛的应用范围,成为了当前电子组件市场上极具竞争力的选择之一。作为一款优质的多层陶瓷电容器,该产品展现了三星在电子元器件制造领域的技术实力与创新能力。
无论是在工程开发还是产品生产中,选用CL05B104KP5NNNC贴片电容,帮助您实现更加可靠和高效的电路设计,是提升产品品质和性能的理想之选。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products