Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CL21A106KPFNNNE是一款高性能表面贴装陶瓷电容(MLCC),由知名电子元器件制造商三星(SAMSUNG)生产。该电容的主要特性包括额定电压10V、容值10μF,以及温度系数为X5R,适用于广泛的电子应用。以下是对该产品的详细介绍,包括它的主要参数、应用场景以及优势。
容量与精度
电压与温度
尺寸与封装
安装类型
CL21A106KPFNNNE电容器是通用的MLCC,广泛应用于多种电子设备和电路设计中,如:
消费电子产品:在智能手机、平板电脑、笔记本电脑等消费类电子产品中,CL21A106KPFNNNE被用作去耦电容、滤波电容及功率管理电路,提升电源稳定性和性能。
工业设备:在工业自动化设备和仪器中,起稳定电压和滤波的作用,确保设备在各种环境下的可靠性。
汽车电子:广泛用于汽车电子系统,如车载信息娱乐系统、车身电子控制模块等,提高系统的稳定性和抗干扰能力。
通信设备:在基站收发器、路由器等通信设备中,作为滤波和去耦组件,优化信号质量。
高可靠性:三星作为全球知名的电子元器件供应商,提供优质的MLCC,具备良好的长期可靠性和稳定性,能够在复杂环境条件下正常工作。
小型化设计:0805封装小巧,适合现代电子产品对空间的高要求,帮助设计师在布局时节省空间,使电路板更加紧凑。
良好的温度特性:X5R温度系数确保了在-55°C到85°C的工作条件下,电容器表现出较小的电容量变化,适用于温差较大的应用环境。
灵活的应用:由于其优异的电气性能和适应性,该电容可以应用于多种电路,满足工程师对多样化电源管理、信号处理等方面的需求。
CL21A106KPFNNNE是一款高性能的10μF表面贴装陶瓷电容器,凭借其小巧的0805封装和±10%的高精度,使其成为各种电子设备中不可或缺的组件。无论是在消费电子、工业设备、汽车电子还是通信设备中,CL21A106KPFNNNE都能凭借其卓越的性能和广泛的适用性,满足不同领域的设计需求。选择CL21A106KPFNNNE,您将获得一款可靠且具性价比的电子元器件,为您的项目提供最佳支持。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products