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CL32Y226KAVVPNE
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- SAMSUNG CL32Y226KAVVPNE
- Type
- SAMSUNG
- Unit
- Electronic Component
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- SAMSUNG
- Electronic Component
- CL32Y226KAVVPNE
- Electronic Component
- 1
- Electronic Component
- 22uF
- Package
- 1210
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.179g
- Electronic Component
- 1
- Electronic Component
- BM0257686754
- Electronic Component
- X7S
- Voltage
- 25V
- Electronic Component
- Electronic Component
- Electronic Component
- 1000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CL32Y226KAVVPNE 产品概述
一、产品简介
CL32Y226KAVVPNE 是三星（SAMSUNG）生产的一款贴片多层陶瓷电容（MLCC），额定参数为 22 µF ±10% / 25 V，介质类型为 X7S，封装规格为 1210（公制约 3.2 mm × 2.5 mm）。该型号面向对容量密度和板上空间有较高要求的电源旁路与去耦、滤波与能量储存场景。
二、主要电气与温度特性
- 标称电容：22 µF
- 容差：±10%（常温标称）
- 额定电压：25 V DC
- 介质与温度系数：X7S（工作温度范围通常为 −55 °C 至 +125 °C，温度造成的电容变化在规定范围内）
- 封装：1210（标准 SMD 尺寸，实际外形尺寸请参照厂商数据手册）
三、性能亮点
- 高体积比电容：在 1210 尺寸下提供 22 µF 的较大电容量，利于减少 PCB 占用面积。
- 低等效串联电阻（ESR）与低等效串联电感（ESL）：适合高频去耦与瞬态能量供给，改善电源稳定性。
- 宽温区稳定性：X7S 比较适合工作温度范围宽、对温度稳定性有一定要求的应用。
- 表面贴装，适合自动化回流焊工艺，便于批量生产。
四、典型应用场景
- MCU、FPGA、ASIC 电源旁路与去耦。
- DC-DC 转换器输出侧滤波与储能。
- 通信设备、消费电子、工业控制等对板上去耦与稳压有要求的电源网络。
（如需用于汽车或关键安全系统，应依据具体认证与可靠性要求选择相应等级产品并确认厂商认证）
五、设计与使用建议
- 注意直流偏置效应：高介电常数 MLCC 在施加 DC 电压时电容会显著下降，实际工作电压下有效电容可能远低于标称值。设计时建议留有裕量或参考厂商 DC-bias 曲线。
- 考虑温度与老化影响：X7S 属于二类介质，随温度和时间会有一定变化，关键电路请留退化裕度并检查长期可靠性。
- 布局建议：用于去耦时尽量靠近供电引脚，减少走线长度与环路面积，以发挥低 ESL/ESR 优势。
- 并联策略：若需更低 ESR/增大容值，可并联多个相同或不同封装的 MLCC，但注意并联后的共振与布局影响。
六、封装与焊接注意
1210 尺寸适配常见贴片工艺，支持回流焊；实际焊盘尺寸、焊膏量与回流曲线应按制造商推荐。运输与贴装前避免长时间暴露于高湿环境，必要时依据 IPC/JEDEC 标准进行干燥处理。
七、选型注意事项
在最终选型前，请获取并核对厂商完整数据手册（包含 DC-bias、频率响应、温度特性、寿命与可靠性试验数据），并在目标应用条件下进行实测验证，确保满足电容、温漂、浪涌与寿命要求。若系统对安全或汽车级规范有要求，应确认产品是否满足相应认证。
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