WMSIC Electronic Components

CL32A107MQVNNWE

ModelCL32A107MQVNNWE
Package1210
BrandSAMSUNG
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
SAMSUNG CL32A107MQVNNWE
Type
SAMSUNG
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SAMSUNG
Electronic Component
CL32A107MQVNNWE
Electronic Component
1
Electronic Component
100uF
Package
1210
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±20%
Electronic Component
0.174g
Electronic Component
1
Electronic Component
BM0263440303
Electronic Component
X5R
Voltage
6.3V
Electronic Component
Electronic Component
Electronic Component
1000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CL32A107MQVNNWE 产品概述

一、概述

CL32A107MQVNNWE 是三星(SAMSUNG)出品的一款贴片多层陶瓷电容(MLCC),规格为 1210 封装(≈3.2×2.5mm),标称容值 100μF,额定电压 6.3V,容差 ±20%,介质为 X5R。该型号在体积与容量之间取得平衡,适用于对容量要求较高且空间有限的表面贴装电源去耦与滤波场合。

二、主要电气参数

  • 容值:100 μF(标称)
  • 精度:±20%
  • 额定电压:6.3 V DC
  • 介质/温度特性:X5R(适用温度范围通常为 -55°C 至 +85°C)
  • 封装:1210(英制“1210”,公制约 3.2×2.5 mm)
  • 极性:无(非极性)

三、性能特点

  • 高容值:在 1210 体积内实现 100μF,适合紧凑电源滤波与去耦。
  • 低等效串联阻抗(ESR):相较于电解电容,MLCC ESR 很低,有利于抑制高频噪声、改善瞬态响应。
  • 温度稳定性:X5R 在规定温度范围内电容变化受控,适合一般工业/消费电子温区。
  • 非极性、寿命长、无电解质泄漏风险。
  • 可用于自动化贴装(卷带供料)。

四、典型应用

  • 移动设备与便携式电子的电源去耦与旁路。
  • DC-DC 转换器输出滤波、输入稳压滤波。
  • 电源管理 IC(PMIC)附近的大容量去耦。
  • 工业与消费类电子需要大容量陶瓷电容的场景。

五、封装与可靠性提醒

1210 为较大封装,100μF 大容量 MLCC 层数多、厚度较大,易受机械应力影响而产生裂纹或焊接应力导致失效。在 PCB 设计与生产过程中建议采取防裂措施(如使用阻焊胶固定、减小板弯曲、优化焊盘形状)。

六、选型与使用注意事项

  • DC 偏置效应:X5R 大容量在施加直流偏置时电容会明显下降,实际工作电压下可用容值需参考厂商 DC-bias 曲线;若要求稳定容量,可考虑提高额定电压或并联多个电容。
  • 温度与频率响应:X5R 在高温或高频时电容会有变化,关键电路应验证实际性能。
  • 机械应力管理:贴片、回流焊后应避免 PCB 弯曲及剥离应力,必要时采用点胶固定或使用多个小封装并联以分散应力。

七、焊接与存储建议

遵循制造商推荐的回流焊曲线与 IPC/JEDEC 规范;贴装前做好湿敏等级(MSL)管理,按规定回流前进行烘烤去湿;库存环境避免潮湿、高温和强震动。

八、总结

CL32A107MQVNNWE 以 1210 体积提供 100μF 大容量和 X5R 温度特性,适合对体积与容值有较高要求的电源去耦与滤波应用。选用时需重点关注 DC-bias、温度响应及机械应力管理,以确保在目标应用中获得稳定可靠的电气表现。若需更精确的 DC-bias 曲线、ESR、容值与寿命数据,建议参考三星官方 datasheet 与样品测试结果。

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