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CL05A225MA5NUNC
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- SAMSUNG CL05A225MA5NUNC
- Type
- SAMSUNG
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SAMSUNG
- Electronic Component
- CL05A225MA5NUNC
- Electronic Component
- 1
- Electronic Component
- 2.2uF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±20%
- Electronic Component
- 0.013g
- Electronic Component
- 1
- Electronic Component
- BM0259574994
- Electronic Component
- X5R
- Voltage
- 25V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CL05A225MA5NUNC 产品概述
一、产品简介
CL05A225MA5NUNC 是 SAMSUNG（三星）生产的贴片多层陶瓷电容（MLCC），规格为 0402（1005 公制）封装，电容量 2.2µF，额定电压 25V，公差 ±20%，介质材料为 X5R。该产品体积小、容值高，适合对空间和电容密度有较高要求的移动设备与消费电子应用，用作旁路、去耦与电源滤波。
二、主要电气与温度特性
- 容值：2.2µF，公称容差 ±20%（制造偏差范围）。
- 额定电压：25V，适用于中高压轨的去耦与能量旁路。
- 介质：X5R（-55°C 至 +85°C），X5R 属于Ⅱ类介质，在该温度范围内电容量的温度变化通常受控（X5R 特性比 C0G 差但容量密度更高）。
- 非极性元件，可任意方向贴装于 PCB。
三、封装与工艺兼容性
- 封装：0402（1005），适合超小型化 PCB 布局，靠近芯片进行近场去耦。
- 焊接工艺：兼容无铅回流焊；为保证可靠性，请遵循贴片电容的常规回流曲线与焊前干燥建议（避免吸湿导致虚焊或裂纹）。
- 包装形式：卷带包装（Tape & Reel），适配自动贴片机高速贴装。
四、应用场景与选型建议
- 典型应用：CPU/GPU、电源管理 IC 的去耦、DC-DC 转换器输入/输出滤波、模拟电路局部旁路、移动终端与可穿戴设备电子模块。
- 选型注意：X5R 虽能提供更高容值密度，但随温度、偏压与时间会有容值变化，关键电路（如高精度滤波或计量）应评估稳定性需求并预留裕量或考虑使用 C0G/NP0。
- 并联建议：若需降低 ESR/ESL 或提高纹波能力，可考虑多只不同值或相同值电容并联使用以优化频率响应。
五、可靠性与装配注意事项
- 机械应力敏感，贴片时避免对元件施加过大弯曲或冲击，焊后冷却应平稳以防裂纹。
- 长期使用时，X5R 类电容存在轻微老化效应，需在关键长期稳定性设计中予以考虑。
- 建议参考制造商的 PCB 焊盘推荐尺寸与回流曲线，必要时进行焊接可靠性验证。
以上为 CL05A225MA5NUNC 的要点概述。如需更详细的等效串联电阻（ESR）、频率特性曲线、温度测试数据或供应与库存信息，可进一步提供具体需求以便查询厂商规格书与性能曲线。
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