Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
CL31B104KBCNNNC
Configuration
1 options
Configuration
Electronic Component
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- SAMSUNG CL31B104KBCNNNC
- Type
- SAMSUNG
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SAMSUNG
- Electronic Component
- CL31B104KBCNNNC
- Electronic Component
- 1
- Electronic Component
- 100nF
- Package
- 1206
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.074g
- Electronic Component
- 1
- Electronic Component
- BM0257694311
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：CL31B104KBCNNNC
一、基本信息
CL31B104KBCNNNC是一款由三星（SAMSUNG）生产的多层陶瓷电容器（MLCC），其额定电容值为0.1μF（100nF），容差为±10%。该电容器设计用于在各种电子电路中提供稳定的电容性能，能够适应广泛的应用场景。电压额定值为50V，符合很多工业电子和消费电子中的安全电压标准。
二、技术参数
- 电容：0.1μF
- 容差：±10%
- 额定电压：50V
- 温度系数：X7R
- 工作温度范围：-55°C ~ 125°C
- 安装类型：表面贴装
- 封装尺寸：1206（3216公制）
- 实际尺寸：3.20mm x 1.60mm (长x宽)
- 最大厚度：0.95mm
三、应用场景
CL31B104KBCNNNC的应用非常广泛，适用于各种电子产品，如手机、电脑、家用电器、汽车电子、工业设备以及消费类电子产品等。其稳定性与可靠性使其在以下情况下尤为合适：
- 去耦和旁路应用：能有效去除高频噪声，保护电路，增强信号稳定性。
- 滤波电路：在电源接口附近能过滤掉高频干扰信号。
- 定时电路：在一些定时应用中，电容器的充放电特性可以确保定时功能的准确性。
- 耦合电路：用于音频电路中，将信号从一个电路传递到另一个电路。
四、元器件特性
- 温度稳定性：X7R是中等级别的温度稳定性，相比X5R具有更好的温度特性，适应温度变化时的电容量变化较少，适用于温度变化大的环境。
- 高压耐受性：50V的电压额定使其能够在多个电子应用中使用，能够承受较高的操作电压，确保了电路的安全性。
- 紧凑封装：1206的封装尺寸使其非常适合现代电子设备，特别是空间受限的设计中。同时，由于其低厚度，能够更好地与其他组件集成。
五、总结
CL31B104KBCNNNC产品以其高可靠性和广泛的适用性，成为当今电子设计中不可或缺的元器件。无论是在日常消费电子产品，还是在对性能有严格要求的工业设备中，这款电容器都能够提供所需的电气性能。选择CL31B104KBCNNNC，不仅能够提升产品的稳定性和可靠性，还可以简化设计过程，减小产品体积，提高产品的市场竞争力。
该电容器是三星在市场上推出的一款高质量产品，凭借其优良的特性及性能，吸引了众多电子工程师及设计师的关注与青睐。随着电子产品向小型化、低功耗及高性能方向的发展，CL31B104KBCNNNC将持续为促进新技术的应用与发展作出贡献。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
