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CL21B475KAFNNNE MLCC CL21B475KAFNNNE
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- SAMSUNG CL21B475KAFNNNE
- Type
- SAMSUNG
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SAMSUNG
- Electronic Component
- CL21B475KAFNNNE
- Electronic Component
- 1
- Electronic Component
- 4.7uF
- Package
- 0805
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.034g
- Electronic Component
- 1
- Electronic Component
- BM69414183
- Electronic Component
- X7R
- Voltage
- 25V
- Electronic Component
- Electronic Component
- Electronic Component
- 2000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：CL21B475KAFNNNE 贴片电容
基本信息
产品名称：CL21B475KAFNNNE
类型：多层陶瓷电容器（MLCC）
品牌：三星（SAMSUNG）
封装类型：0805
电容量：4.7µF
额定电压：25V
容差：±10%
温度系数：X7R
工作温度范围：-55°C ~ 125°C
电容的特点与优势
CL21B475KAFNNNE 是一种性能可靠的多层陶瓷电容，具有5%的精度和出色的温度特性，设计用于满足广泛的电子应用需求。其电容量为4.7µF，额定电压达25V，适用于低功率应用和中等电压条件下的使用。该电容在温度变化范围内保持稳定的电容值，确保在高温及低温环境中依然能够正常工作，适配复杂环境的电子设备。
温度系数与性能
采用X7R温度系数意味着该电容器在-55°C至125°C的环境下适应性良好，电容变化不会超出±15%。这使得CL21B475KAFNNNE非常适合于要求严苛的工作条件，如汽车、工业控制、消费电子等领域。无论在极冷或极热的情况下，该电容始终展现出优越的性能，保证了电子电路的稳定性和可靠性。
多层陶瓷电容的优势
相比于其他类型的电容器，多层陶瓷电容具有更高的电容量密度和更低的等效串联电阻（ESR），因此可以实现更小的体积设计，同时满足高频应用所需的高稳定性。此外，其良好的抗振动和抗冲击性能，使得CL21B475KAFNNNE成为在恶劣环境中使用的理想选择，如工业设备和户外电源等。
封装与尺寸
CL21B475KAFNNNE采用0805封装，尺寸为2.00mm x 1.25mm，厚度最大为1.35mm，适合表面贴装（SMD）技术，便于自动化生产线的快速组装。这种封装形式在现代电子产品中被广泛应用，特别是在空间有限的紧凑型设计中，能够有效节约板上空间，提升整体性能。
应用领域
该贴片电容的应用领域广泛，涵盖了诸如智能手机、平板电脑、家用电器、LED照明、汽车电子、工业控制、医疗设备等多种电子产品。在电源滤波、去耦、耦合等电路中，CL21B475KAFNNNE都能够发挥其优秀的性能，降低电路干扰，提高信号质量。
结论
综合来说，CL21B475KAFNNNE是一款适合多种电子应用的高性能贴片电容。其优良的温度稳定性、可靠的电压和容差特性，使其在现代电子设计中成为一种受欢迎的选择。无论是对电性能的要求，还是对体积和重量的考虑，这款电容均能提供可靠的解决方案。未来在开发新产品时，选择CL21B475KAFNNNE将有助于提升产品的整体性能和市场竞争力。
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