WMSIC Electronic Components

CL10B105KA8NNNC MLCC CL10B105KA8NNNC

ModelCL10B105KA8NNNC
Package0603
BrandSAMSUNG
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
SAMSUNG CL10B105KA8NNNC
Type
SAMSUNG
Unit
Electronic Component
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
SAMSUNG
Electronic Component
CL10B105KA8NNNC
Electronic Component
1
Electronic Component
1uF
Package
0603
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.045g
Electronic Component
1
Electronic Component
BM69413635
Electronic Component
X7R
Voltage
25V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:CL10B105KA8NNNC 贴片陶瓷电容器

一、产品基本信息

CL10B105KA8NNNC 是一款由全球知名电子元器件制造商三星(SAMSUNG)生产的多层陶瓷电容器(MLCC),它采用表面贴装技术(SMD),常用于各种电子设备的电路设计与构建。这款电容器具有精确的电容值、稳定的电气特性和广泛的应用场景,适合于现今快速发展的电子产品需求。

二、关键参数

  • 安装类型: 表面贴装(SMD)
  • 封装尺寸: 0603 (1.60mm x 0.80mm)
  • 电容值: 1µF
  • 额定电压: 25V
  • 工作温度范围: -55°C 至 125°C
  • 温度系数: X7R
  • 电容容差: ±10%
  • 厚度: 最大0.035" (0.90mm)
  • 应用: 通用型电容器

三、性能特点

  1. 小型化设计: CL10B105KA8NNNC 的0603封装尺寸使其在电路板上占用极小的空间,尤其适合于对空间及重量均有严格要求的便携式和移动设备。

  2. 高稳定性: 此电容器采用 X7R 温度系数,这使得它在温度变化时表现出良好的电气稳定性。X7R 系列电容器能在 -55°C到125°C 的宽广温度范围内维持相对恒定的电容值,适合各种环境条件下的电子应用。

  3. 良好的电气性能: 本型号电容器的额定电压为 25V,电容值为 1µF,能够满足大多数高频和高压应用需求。同时,±10%的电容容差使得其在设计上的适应性更强,能够灵活应用于多种电路中。

  4. 广泛的应用范围: 该电容器在功率管理、滤波、耦合及去耦等应用中表现优异,适用于智能手机、平板电脑、平面显示器、家用电器及各类消费电子产品等。

四、应用场景

CL10B105KA8NNNC 贴片陶瓷电容器广泛用于以下领域:

  • 消费电子: 在智能手机、平板电脑及其他便携设备中进行去耦和滤波,提升电源管理的效率。
  • 汽车电子: 应用于车载显示、导航设备等,因其的工作温度范围广,适合在不同的气候条件下使用。
  • 通信设备: 在无线通信和网络设备中用作离散元件,确保信号的稳定性及完整性。
  • 工业设备: 在各种工业控制设备中,提升设备的工作可靠性与耐久性。

五、总结

总的来说,CL10B105KA8NNNC 贴片陶瓷电容器是一款功能强大且灵活多用的电子元件。其小型化设计、高温稳定性及广泛应用的特性,使其成为各类电子产品中不可或缺的重要组成部分。在选型时,考虑到其卓越的性能和广泛的适用性,CL10B105KA8NNNC 无疑是设计工程师们在进行电路优化尤其是在空间和稳定性方面的理想选择。无论是高频滤波、去耦还是能效管理,这款电容器都能为您提供可靠的电气性能。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.