WMSIC Electronic Components

CL31A475KB9LNNC MLCC CL31A475KB9LNNC

ModelCL31A475KB9LNNC
Package1206
BrandSAMSUNG
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
SAMSUNG CL31A475KB9LNNC
Type
SAMSUNG
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SAMSUNG
Electronic Component
CL31A475KB9LNNC
Electronic Component
1
Electronic Component
4.7uF
Package
1206
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.074g
Electronic Component
1
Electronic Component
BM0265062328
Electronic Component
X5R
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CL31A475KB9LNNC 产品概述

一、基本参数

CL31A475KB9LNNC 为 Samsung(三星)生产的贴片多层陶瓷电容(MLCC),主要参数如下:

  • 电容量:4.7 μF
  • 额定电压:50 V DC
  • 公差:±10%
  • 温度特性:X5R(介质特性,-55°C 至 +85°C)
  • 封装尺寸:1206(英寸制,3.2 mm × 1.6 mm)
  • 封装形式:贴片(SMD),常见为卷带(tape & reel)

二、主要特性

  • 大电容量与中高压等级的结合,适合在空间受限但需要较大储能的场合使用。
  • X5R 属于 Class II 陶瓷介质,具备较高的介电常数,体积与电容量比高于 NP0/COG,但温度与电压稳定性较差。
  • MLCC 本身具有极低的等效串联电阻(ESR)和等效串联电感(ESL),在高频去耦和瞬态响应上表现优异。
  • 封装 1206 提供良好的焊接可靠性与机械强度,但仍需注意PCB应力控制以防裂片。

三、典型应用

  • 开关电源输入/输出滤波与去耦
  • 稳压器(LDO/SMPS)输出旁路与电荷储能
  • 汽车电子辅助电源(需符合对应汽车等级时验证环境适应性)
  • 工业控制、通讯设备的中等能量滤波场合

四、设计与选型要点

  • DC bias(直流偏压)效应:X5R 在较高直流电压下电容量会明显下降,设计时应参考厂商的电容随偏压变化曲线,预留足够裕量。
  • 温度特性:X5R 在低温或高温极端下电容量会变化,精确电容需求应考虑采用温度系数更稳定的介质。
  • 并联使用:若需降低等效ESR或补偿DC bias效应,可采用并联多个电容组合使用。
  • 可靠性裕量:在关键电源回路建议采用额定电压高于工作电压的器件(如 50V 器件用于 12–24V 系统时余量充足)。

五、封装与贴装工艺建议

  • 采用推荐的PCB焊盘尺寸与焊膏量,避免过量焊膏导致应力集中。
  • 贴片位置应尽量远离板边和有较大弯曲应力的区域,防止热应力或机械应力引起裂纹。
  • 推荐遵循元器件厂商的回流焊曲线,避免超温或重复加热。长期贮存后如出现可焊性疑虑,可参考厂商建议进行预烘烤。

六、可靠性与存储

  • MLCC 抗热循环与振动能力良好,但对机械冲击和板弯曲敏感,装配时注意夹具与夹紧力。
  • 存储环境建议干燥、常温,避免剧烈振动与潮湿;长时间存放后上机前可做外观检查与必要的烘干处理。
  • 典型失效模式为机械破裂、电容量随时间(老化)和偏压下降,设计时考虑冗余与容差。

七、采购与技术支持

  • 该料号为 Samsung 标准产品,常见包装为带卷供货,订购时注意最小包装数量与批次一致性。
  • 在关键应用(汽车、医疗、航天等)使用前,建议向供应商索取详细的电容-电压曲线、温度曲线、可靠性测试报告与样品验证。

如需更详细的特性曲线(DC bias、频率响应、温度特性)或推荐的 PCB land pattern,可提供用途与工作条件,我可根据具体需求给出更精确的选型与布局建议。

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