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CL10B102KC8WPNC MLCC CL10B102KC8WPNC
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- SAMSUNG CL10B102KC8WPNC
- Type
- SAMSUNG
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SAMSUNG
- Electronic Component
- CL10B102KC8WPNC
- Electronic Component
- 1
- Electronic Component
- 1nF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.035g
- Electronic Component
- 1
- Electronic Component
- BM0231141987
- Electronic Component
- X7R
- Voltage
- 100V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CL10B102KC8WPNC 产品概述
一、产品简介
CL10B102KC8WPNC 为三星（SAMSUNG）品牌的贴片多层陶瓷电容（MLCC），基本参数：容值 1nF（102），精度 ±10%（K），额定电压 100V，介质材料 X7R，封装规格 0603（1608 公制）。该型号适用于对体积、稳定性和耐压有中等要求的宽泛电子应用场景。
二、主要性能与参数
- 容量：1nF ±10%
- 额定电压：100V DC（具体耐压与过压裕度请参见厂家数据手册）
- 温度特性：X7R（可在 -55°C 至 +125°C 范围内工作，温度变化引起的容量漂移在典型范围内）
- 封装：0603（适合高密度贴装）
- 特性：低等效串联电阻（ESR）和低等效串联电感（ESL），响应快，适合去耦、滤波等用途
三、典型应用场景
- 电源去耦与旁路（DC-DC 模块、稳压器输入/输出）
- 高频滤波与阻抗匹配（射频前端低频旁路）
- 抗干扰电路与信号线耦合/隔离
- 工业控制、通信设备、消费类电子及测量仪器等需要小体积、高密度贴装的场合
四、设计与使用建议
- DC 偏置效应：陶瓷介质在高偏压下会产生容量下降，设计时须考虑在实际工作电压下的有效容量，必要时进行实测验证或按厂方 DC-bias 曲线选型。
- 布局：去耦电容应尽量靠近电源引脚与地平面，焊盘短、宽、对称以降低寄生阻抗。
- 回流焊：遵循厂家建议的回流温度曲线，避免温度骤升骤降；对于潮湿敏感的贴片，请在开封后按建议时间回流或进行烘烤。
- 焊盘尺寸与焊膏量：建议参考三星官方推荐的 PCB land pattern，以兼顾焊接可靠性与电气性能。
- 机械应力：0603 尺寸虽小，但对板弯曲及机械挤压敏感，布局时避免将电容置于受力集中区域或穿孔边缘附近。
五、可靠性与储存注意
- 湿敏性：若封盘拆封后暴露于高湿环境，建议按厂家规定进行干燥（烘烤）处理后再回流。
- 机械损伤：注意回流前后的搬运与贴装，防止外力造成裂纹。
- 温度循环与老化：X7R 介质具有良好的温度范围，但长期高温或频繁温度循环会影响容值稳定性，应在可靠性评估中考虑寿命衰减。
六、选型建议
CL10B102KC8WPNC 以其 100V 耐压与 0603 小封装的组合，适合在对体积与耐压有平衡需求的电路中使用。若电路对温度稳定性或容量随电压衰减敏感，建议与备用方案（如 NP0/C0G 或更大尺寸 MLCC）比较，并参考厂家完整数据手册与 DC-bias 曲线进行最终确认。若需采购或获得实物尺寸、焊盘建议、可靠性试验数据，请直接参考三星官方资料或向供应商索取技术支持。
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