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CL31A226KAHNNNE MLCC CL31A226KAHNNNE
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- SAMSUNG CL31A226KAHNNNE
- Type
- SAMSUNG
- Unit
- Electronic Component
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- SAMSUNG
- Electronic Component
- CL31A226KAHNNNE
- Electronic Component
- 1
- Electronic Component
- 22uF
- Package
- 1206
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.084g
- Electronic Component
- 1
- Electronic Component
- BM0000001250
- Electronic Component
- X5R
- Voltage
- 25V
- Electronic Component
- Electronic Component
- Electronic Component
- 2000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：SAMSUNG CL31A226KAHNNNE 贴片电容
概述
SAMSUNG CL31A226KAHNNNE 是一款高性能的多层陶瓷电容器（MLCC），采用表面贴装（SMD）技术，广泛应用于各类电子设备中。其电容值为22µF，额定电压为25V，拥有 ±10% 的容差，工作温度范围在 -55°C 到 85°C 之间，适合于多种复杂工况和环境。此款电容器根据 X5R 温度系数设计，使其在温度变化时电容值的稳定性得以保证。
主要特性
- 电容规格：22µF，是对于电源管理、滤波及耦合应用等用途非常合适的电容量值，可有效提高电路稳定性和响应速度。
- 额定电压：25V，在适用电压范围内，可满足大多数电子产品的设计需求，提供足够的安全裕度，确保电容器的可靠工作。
- 温度范围：工作温度范围从 -55°C 到 85°C，适合于各种气候条件和环境。尤其适用于在高温或冷环境下工作的设备，如汽车电子、工业控制器等。
- 温度系数：采用 X5R 温度系数，提供较好的电容稳定性，适合于用于温度变化较大的应用场合。在这个温度范围内，其电容值变化可控制在 ±15% 以内。
- 安装方式：表面贴装技术（SMD）设计，使其能够在现代高密度电路板上轻松使用，极大地节省了空间与重量。
- 封装尺寸：此电容器的封装尺寸为 1206 (3.20mm x 1.60mm)，在保持高电性能的同时，支持高密度布局，提高整体电路设计的灵活性。
应用领域
SAMSUNG CL31A226KAHNNNE 贴片电容适用于多个领域，其广泛应用于：
- 消费电子：如智能手机、平板电脑、笔记本电脑等设备中的电源管理和去耦合电路。
- 工业设备：在工控系统、自动化设备中提供电源耦合和滤波功能。
- 汽车电子：如汽车控制单元（ECU）和传感器电路，以其优秀的温度特性保证在极端工作环境下的可靠性。
- 医疗设备：在医疗仪器中使用，确保在关键应用中提供稳定的电源与信号处理。
性能优势
- 稳定性：X5R 温度系数设计保证了在温度变化时电容性能的稳定，对于温度敏感的应用极具优势。
- 长寿命：陶瓷电容器具有优于电解电容的寿命表现，可满足车载等高可靠性场合的需求。
- 低 ESR 和 ESL：该电容器的低等效串联电阻（ESR）和等效串联电感（ESL）特性，使其在高频信号传输中表现优异，能够有效抑制噪声和Ripple。
结论
SAMSUNG CL31A226KAHNNNE 贴片电容是一款在多种应用中既具备高效能又可靠的电容器，凭借其优异的电气性能、适应广泛的温度范围以及紧凑的封装设计，它成为现代电子产品和系统设计中的首选元件之一。无论是在消费电子、工业设备还是汽车领域，它的表现必能满足设计师对高性能和高可靠性的严格要求。
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