Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
CL21B106KOQNNNE MLCC CL21B106KOQNNNE
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- SAMSUNG CL21B106KOQNNNE
- Type
- SAMSUNG
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SAMSUNG
- Electronic Component
- CL21B106KOQNNNE
- Electronic Component
- 1
- Electronic Component
- 10uF
- Package
- 0805
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.043g
- Electronic Component
- 1
- Electronic Component
- BM69414004
- Electronic Component
- X7R
- Voltage
- 16V
- Electronic Component
- Electronic Component
- Electronic Component
- 2000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CL21B106KOQNNNE 产品概述
CL21B106KOQNNNE是一款由三星电子（SAMSUNG）制造的多层陶瓷电容器（MLCC），具有多种优良特性，广泛应用于电子设备中，以满足现代技术对高效能和紧凑设计的需求。这款电容器的主要参数包括额定电容为10µF，额定电压为16V，容差为±10%，而且采用温度系数为X7R的材料，能够在广泛的工作温度范围内稳定工作。
主要参数
- 电容值: 10µF
- 电压额定值: 16V
- 容差: ±10%
- 温度系数: X7R
- 工作温度范围: -55°C 到 125°C
- 安装形式: 表面贴装（SMD）
- 封装尺寸: 0805 (2.00mm x 1.25mm)
- 厚度: 最大1.40mm
该电容器的封装尺寸为0805，是一种常见的表面贴装元件，因其较小的占用空间，特别适合在空间有限的电路板中使用。电容器的厚度限制在1.40mm以内，使其更加适合高密度电子装置，如手机、计算机和各种消费电子产品。
温度特性和稳定性
X7R是电容器的一种可靠温度特性材料，能够确保在-55°C到125°C的范围内保持性能稳定。对于需要在极端环境中工作的设备，X7R温度特性不仅能提供良好的耐压表现，还能降低温度变化对电容值带来的影响。这种类型的电容器通常适用于需要广泛温度范围和较好电容稳定性的应用。
应用场景
CL21B106KOQNNNE电容器的应用非常广泛，特别适合以下领域：
- 消费电子产品: 像智能手机、平板电脑、数码相机等设备中，它们需要小型、高效能的电子元件以达到良好的性能。
- 计算机与网络设备: 在主板、显卡、内存模块及其他配件中，均需要借助这样的电容器来提高电路的稳定性和效率。
- 工业设备: 在自动化控制设备、传感器和其他工业应用中，可靠的电容器是保证设备长期稳定运行的关键元件。
- 汽车电子: 随着现代汽车电子化程度的提高，该电容器也被广泛应用于汽车控制系统中。
设计考虑
在设计电路时，选用CL21B106KOQNNNE电容器需要考虑电路的整体要求，包括电压、温度变化、频率以及电容的有效值。由于电容器的容差为±10%，这意味着真实电容值可在9µF到11µF之间浮动。因此，设计者在选择电容器时，需确保所选择的电容能够满足电路的要求。
此外，由于该电容器为表面贴装类型，建议在PCB设计时预留足够的焊接区域，以确保焊接质量和产品的可靠性。选择适当的制造工艺和材料，可以有效提高其电气性能及耐用性。
结语
总的来说，CL21B106KOQNNNE电容器在电子行业内以其优异的性能和广泛的应用场景，成为了设计师和工程师在选择电容时的一个理想选择。无论是用于紧凑型设备还是高效能的工业应用，它都能够为电子产品提供可靠和稳定的电力支持，为现代电子设备的发展贡献力量。选择这款电容器能使产品在性能、可靠性和经济性上达到理想状态。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
