Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
CL10B225KP8NNNC MLCC CL10B225KP8NNNC
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- SAMSUNG CL10B225KP8NNNC
- Type
- SAMSUNG
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SAMSUNG
- Electronic Component
- CL10B225KP8NNNC
- Electronic Component
- 1
- Electronic Component
- 2.2uF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.035g
- Electronic Component
- 1
- Electronic Component
- BM69414120
- Electronic Component
- X7R
- Voltage
- 10V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CL10B225KP8NNNC 产品概要
一、产品简介
CL10B225KP8NNNC 是三星（SAMSUNG）公司生产的一款高性能表面贴装陶瓷电容器（MLCC）。其电容值为2.2 微法拉（µF），额定电压为10 伏（V），具备±10%的电容容差。这款电容采用 X7R 温度系数，适用于多种通用电子应用，尤其在高温和低温环境下展现优异的稳定性。
二、主要特性
电容量与电压：
- 电容值：2.2 µF，适合滤波、耦合和旁路等多种电路应用。
- 额定电压：10V，确保在大多数常规电源电路中安全稳定工作。
容差：
- 容差范围：±10%，提供相对较高的精度，适合对精度有一定要求的电路设计。
温度系数：
- 类型：X7R，能够在-55°C至125°C的温度范围内保持良好的电性能，适合在严苛环境下使用。
安装类型：
- 表面贴装：0603封装（即1.6mm x 0.8mm），适合现代主流电子产品的小型化需求。
尺寸：
- 外形尺寸：0.063" 长 x 0.031" 宽（1.60mm x 0.80mm），厚度最大值为0.035"（0.90mm），为紧凑型设计提供了灵活性，适合各种PCB布局。
三、应用场景
CL10B225KP8NNNC 电容器广泛应用于以下领域：
- 消费电子：如手机、平板电脑、笔记本电脑等，提供稳定的电源管理和信号耦合功能。
- 工业设备：适用于各种工业控制器和监控系统，确保系统稳定性。
- 通讯设备：如基站、路由器等需要高可靠性的产品，满足其对电源和信号的隔离处理需求。
- 汽车电子：在电动汽车和传统汽车的电子控制单元（ECU）中实现信号过滤和稳压。
四、性能优势
CL10B225KP8NNNC 作为一款优秀的表面贴装电容器，具有以下优势：
- 稳定性高：采用 X7R 温度系数的材料，提高了电容在不同环境温度下的稳定性。
- 小型化设计：0603 封装让这款电容极其适合现代电子产品的小型化需求，符合消费电子行业的发展趋势。
- 耐高低温：工作温度范围广泛，从-55°C到125°C，铺展了其应用的环境范围，不论是严寒还是高温，都能保持稳定的电性能。
- 高可靠性：作为全球知名品牌三星的产品，其制造工艺和产品质量得到了广泛认可，能够长期持续稳定工作，减少维护和更换的成本。
五、总结
CL10B225KP8NNNC 是一款高性能、高可靠性的表面贴装电容器，适用于各种严苛的电气环境，为现代电子设备提供必要的电源管理和信号处理能力。凭借其优越的技术参数和广泛的应用领域，CL10B225KP8NNNC 绝对是设计师和工程师在选择电容器时的值得考虑的优秀型号。无论是在消费电子、工业设备、通讯设备还是汽车电子等多个领域，它都展示出极大的灵活性和可靠性，在满足设计要求的同时，提升了产品的整体性能和市场竞争力。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece Integrated Circuit for IRS20124S IRS21956S SOP-20 IRS2453DS SOP-14
- Model
- IRS20124S
- Package
