WMSIC Electronic Components

CL21B105KBFNNNE MLCC CL21B105KBFNNNE

ModelCL21B105KBFNNNE
Package0805
BrandSAMSUNG
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
SAMSUNG CL21B105KBFNNNE
Type
SAMSUNG
Unit
Electronic Component
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
SAMSUNG
Electronic Component
CL21B105KBFNNNE
Electronic Component
1
Electronic Component
1uF
Package
0805
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.04g
Electronic Component
1
Electronic Component
BM0000000780
Electronic Component
X7R
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
2000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:CL21B105KBFNNNE 贴片电容

一、产品简介

CL21B105KBFNNNE 是一款由三星(SAMSUNG)生产的高性能多层陶瓷电容(MLCC),其设计旨在满足广泛的电子应用需求。该电容器具有1µF的额定电容量,宽广的工作温度范围以及适合高要求环境的特性。此产品采用0805(2012公制)封装,便于表面贴装,满足现代电子设备低空间要求的趋势。

二、基本参数

  • 电容量:1µF
  • 容差:±10%
  • 额定电压:50V
  • 温度系数:X7R
  • 工作温度范围:-55°C至125°C
  • 安装类型:表面贴装(SMT),多层陶瓷电容(MLCC)
  • 封装尺寸:0805(2.00mm x 1.25mm)
  • 厚度(最大值):0.053"(1.35mm)

三、电容构造与特性

CL21B105KBFNNNE 的基材为多层陶瓷,这种结构使其在小体积的基础上,提供较高的电容值。X7R温度系数确保该电容在较广泛的温度变化下,电容值变化小于±15%。这种特性使得此电容能够在高温和低温环境中稳定工作,表现出良好的温度特性和电气性能。

该电容的50V额定电压,使其在许多通用应用中表现出色,尤其是在高电压和高频的电源应用中。与大多数内容相同,电容的容差为±10%,这确保了其电容值在制造公差范围内的可靠性,对于电路设计师来说,这种稳定性尤为重要。

四、应用场景

CL21B105KBFNNNE 广泛应用于多种电子设备,以下是几个典型应用场景:

  1. 消费电子产品:如智能手机、平板电脑和个人计算机,通常需要小型化和高性能的电容器来满足设计要求。

  2. 消费级和工业级电源管理:合适的电压和电容使其在开关电源、稳压电源等电路中得到充分应用,以实现良好的去耦和滤波效果。

  3. 高速信号处理:在高速数字电路中,低ESR(等效串联电阻)和低 ESL(等效串联电感)是提高信号质量的关键,CL21B105KBFNNNE 能够有效减少信号串扰与反射。

  4. 汽车电子:由于其宽工作温度范围,此电容器特别适合在严酷的汽车环境中使用,提供稳定的性能。

五、封装与安装注意事项

CL21B105KBFNNNE 采用0805封装,适用于表面贴装技术(SMT)。设计者需要注意以下几点:

  1. 焊接工艺:要保证在焊接期间不超过电容的耐热极限,一般建议使用适当的回流焊工艺,以避免损坏陶瓷结构。

  2. PCB布局:在布局电路板时,应考虑电容的去耦或滤波位置,确保尽可能减少与其他元件的干扰,提高电路的整体性能。

六、总结

CL21B105KBFNNNE 是一款功能强大且高度可靠的MLCC,适用于多种应用场景。其优良的电气特性、宽广的工作温度范围和小型封装让其成为现代电子设备中不可或缺的重要元器件。三星作为全球领先的电子元器件制造商,其产品不仅质量优良,还提供了广泛的售后支持,使得设计师在应用此元器件时能够更加放心,进而确保整个电子系统的性能和稳定性。

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