Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
CL05B104KO5NNNC MLCC CL05B104KO5NNNC
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- SAMSUNG CL05B104KO5NNNC
- Type
- SAMSUNG
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- SAMSUNG
- Electronic Component
- CL05B104KO5NNNC
- Electronic Component
- 1
- Electronic Component
- 100nF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.023g
- Electronic Component
- 1
- Electronic Component
- BM0000000810
- Electronic Component
- X7R
- Voltage
- 16V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：CL05B104KO5NNNC 贴片电容器
概述
CL05B104KO5NNNC 是三星电子（SAMSUNG）推出的一款高性能多层陶瓷电容器（MLCC），其电容值为0.1µF，电压额定值为16V，容差为±10%。该电容器采用0402封装（即1.00mm x 0.50mm），适合表面贴装，广泛应用于通信、消费电子、工业控制和汽车电子等领域。
主要参数
- 电容: 0.1µF
- 容差: ±10%
- 额定电压: 16V
- 温度系数: X7R
- 工作温度范围: -55°C 至 +125°C
- 封装类型: 0402（1005公制）
- 产品尺寸: 0.039" 长 x 0.020" 宽（1.00mm x 0.50mm）
- 最大厚度: 0.022"（0.55mm）
设计与应用
CL05B104KO5NNNC电容器是基于X7R温度系数材料制造的，这种材料在不同温度和电压条件下具有较为稳定的电容特性。X7R系列电容能够在-55°C到125°C的工作温度范围内保证电容值的稳定性，非常适合多种应用需求。
这种电容器的设计使其在尺寸上，特别适应现代电子设备中对高密度布线的要求。0402的封装类型提供了较小的总体尺寸，使得设计师可以最大程度地节省电路板空间，便于高性能设备的开发。
CL05B104KO5NNNC在电子电路中的应用场景极其广泛，包括：
- 机电系统: 在电源过滤、耦合和解耦隔离电路中使用。
- 消费电子: 在智能手机、平板电脑、笔记本电脑等便携式设备中，作为电源管理与信号处理的关键组件。
- 汽车电子: 适用于车载安全系统、娱乐信息系统等。
- 工业设备: 对于各种控制和监测设备需求稳定性和抗干扰性的场合尤为合适。
性能优势
- 稳定性高: X7R材料实现了良好的温度稳定性，适合在变温条件下工作，在工业和汽车环节中表现尤为突出。
- 小型化: 0402的尺寸使其适合于小型和紧凑型的电路设计，为现代设备的高集成化带来了便利。
- 耐用性: 此电容器能承受较为严苛的环境条件，如高温、高湿和震动等，符合工业和军事的相关标准。
- 广泛兼容性: 其通用型的设计使得CL05B104KO5NNNC 电容器可在众多不同的电路设计中应用，提升了其适应性。
结论
总之，CL05B104KO5NNNC 贴片电容器是一款性能优越的电容元件，具备良好的稳定性和广泛的应用场景。无论是在消费电子、汽车工业还是工业控制系统中，这款电容器都能提供可靠的性能，满足各类高端应用的需求。凭借其出色的工作特性与便于集成的设计，本产品是实现高效电子电路设计的理想选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
