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SAMSUNG CL21B473KBANNNC 是一款高品质的贴片多层陶瓷电容器(MLCC),采用0815封装形式,具有50V的额定电压和±10%的电容容差,电容值为0.047μF(47nF)。这款电容器结合了卓越的特性和广泛的应用适应性,非常适合现代电子设备中的各种电气和电子应用。
高耐压与温度范围: CL21B473KBANNNC在-55°C至125°C的温度范围内正常工作,这使其极具适应性,对环境变化的适应性尤为突出,广泛应用于各种操作环境中。
精确的电容值: 该电容器提供0.047μF的电容值,容差为±10%,这在用于电源滤波、耦合、去耦等场合时展现出良好的稳定性和可靠性。
优质材料与技术: 采用X7R温度系数,这意味着其电容值随温度变化的偏差较小,对于需要严密控制信号和电压的应用来说,非常理想。
小型封装设计: 0805封装使得CL21B473KBANNNC在体积上相对紧凑,便于在小型电路板上进行高密度布局,同时也符合现代电子设计对空间和重量的严格要求。
由于其优越的耐压和工作温度范围,CL21B473KBANNNC被广泛应用于以下几个领域:
消费电子: 包括智能手机、平板电脑、笔记本电脑等产品中,运用于音频、视频信号的耦合和去耦。
工业设备: 在工业自动化设备、传感器和控制系统中,CL21B473KBANNNC可用于电源管理、信号滤波和噪声抑制。
电力供应系统: 在开关电源和直流-直流变换器中,提供滤波与稳压功能,确保电路运行的稳定性。
医疗设备: 在对可靠性要求极高的医疗设备中,该电容器的性能能够有效支持设备的长期稳定运行。
在设计电路时,需要注意以下几点:
SAMSUNG CL21B473KBANNNC是一款高性能的贴片多层陶瓷电容器,具有出色的电气参数和广泛的应用潜力。其在消费电子、工业设备、电力供应系统以及医疗设备领域的广泛适用性,使其成为现代电子设计中不可或缺的一部分。同时,三星作为全球知名品牌,其产品也充分保证了可靠性与稳定性,为电子设计师提供了强有力的支持。选择CL21B473KBANNNC,您将获得高效、可靠的电气解决方案。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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