Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
CL31B225KCHSNNE MLCC CL31B225KCHSNNE
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- SAMSUNG CL31B225KCHSNNE
- Type
- SAMSUNG
- Minimum package
- 2000 个
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SAMSUNG
- Electronic Component
- CL31B225KCHSNNE
- Electronic Component
- 1
- Electronic Component
- 2.2uF
- Package
- 1206
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.064g
- Electronic Component
- 1
- Electronic Component
- BM0263519384
- Electronic Component
- X7R
- Voltage
- 100V
- Electronic Component
- Electronic Component
- Electronic Component
- 2000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：SAMSUNG CL31B225KCHSNNE MLCC 贴片电容
SAMSUNG（三星）是全球知名的电子元器件制造商，其产品广泛应用于消费电子、通信设备、工业控制等领域。CL31B225KCHSNNE是一款高性能的多层陶瓷电容器（MLCC），其设计和性能使其在现代电子电路中具有重要的应用价值。以下是对这款电容器的详细概述，包括其规格、特性、应用场景及优势分析。
1. 基础参数
CL31B225KCHSNNE电容器采用表面贴装技术（SMD），符合现代电子设备对节省空间和提高组件密度的要求。其尺寸为0.126"长 x 0.063"宽（3.20mm x 1.60mm），厚度最大为0.071"（1.80mm）。这一尺寸使其能够轻松集成于各种尺寸限制严苛的电路板中。
- 电容值：2.2µF
- 额定电压：100V
- 温度范围：-55°C至125°C
- 温度系数：X7R，适应不同环境条件下的稳定工作
- 容差：±10%
- 特性：软端子，提供更好的机械稳定性，降低了由热胀冷缩引起的失效风险
2. 材料和构造
该电容器采用多层陶瓷技术制造，具有良好的电气绝缘性和低损耗特性。X7R温度系数确保了电容器在整个工作温度范围内的稳定性。与其他材料相比，陶瓷材料具备更高的耐热性和耐湿性能，使其能够在恶劣的环境条件下正常工作。
3. 应用场景
CL31B225KCHSNNE电容器可广泛应用于多种领域，包括但不限于：
- 消费电子：如智能手机、平板电脑、电视及音响系统等。
- 通信设备：如路由器、基站、网络交换机等高频设备中，提供信号耦合和滤波功能。
- 工业控制：在PLC、工业自动化设备中起到储能和滤波作用，确保电路的稳定性。
- 汽车电子：在现代汽车中，尤其是电动和混合动力汽车中的电池管理系统、动力控制模块等。
4. 技术优势
- 高稳定性：X7R材料在不同温度和电压下表现出色，适合长期稳定运行。
- 小型化设计：其小巧的封装有助于实现电路板的高密度布局，非常适合空间有限的应用。
- 耐用性：该电容器能在极端的工作条件下保持其性能，降低了设备的维护需求和故障率。
- 优良的ESR特性：低等效串联电阻（ESR）使其在高频应用中表现良好，提高了电能转换效率。
5. 结论
SAMSUNG CL31B225KCHSNNE是一款集小型化、稳定性和耐用性于一体的高性能多层陶瓷电容器。其多种优良特性使其适用于广泛的应用场景，成为现代电子设备中不可或缺的核心组件。无论是在消费电子、通信设备还是工业自动化领域，CL31B225KCHSNNE都能为电路设计提供强大的支持，助力设备的高效稳定运行。选择CL31B225KCHSNNE，您将体验到三星在电子领域的技术实力与创新能力。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
