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CL21B102KBCNNNC MLCC CL21B102KBCNNNC
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- SAMSUNG CL21B102KBCNNNC
- Type
- SAMSUNG
- Unit
- Electronic Component
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- SAMSUNG
- Electronic Component
- CL21B102KBCNNNC
- Electronic Component
- 1
- Electronic Component
- 1nF
- Package
- 0805
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.034g
- Electronic Component
- 1
- Electronic Component
- BM0058420133
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：CL21B102KBCNNNC
CL21B102KBCNNNC 是一款由三星（SAMSUNG）品牌生产的多层陶瓷电容器（MLCC），其规格为1000pF（即1nF），具有±10%的容差，额定电压达到50V，符合 X7R 温度特性。这种电容器被广泛应用于各种电子设备中，提供了良好的电气性能和稳定性。
基础参数
电容量：1000pF（1nF）
- 该电容容量适用于高频电路和滤波应用，能够有效地平滑电流波动和降低噪声。
容差：±10%
- 这种容差范围确保了电容器的性能稳定，适合要求较高的应用场合。
额定电压：50V
- 能够承受高达50V的工作电压，使其适合多种电源电路应用。
温度系数：X7R
- X7R是一种常用的温度系数，意味着在-55°C到125°C的温度范围内，电容值变化不超过±15%。这种特性使得该电容器在高温和低温条件下保持良好的工作性能。
工作温度范围：-55°C ~ 125°C
- 该电容器具有广泛的工作温度范围，适应不同环境条件，适合汽车、工业、消费电子等领域的应用。
安装类型：表面贴装（MLCC）
- 采用表面贴装技术，便于自动化生产，提高了组装效率。
封装等级：0805 （2012 公制）
- 封装尺寸为0.079" 长 x 0.049" 宽（2.00mm x 1.25mm），使其适合空间受限的应用环境。
厚度（最大值）：0.037"（0.95mm）
- 较薄的设计增强了其在小型化电路中的适用性。
应用领域
CL21B102KBCNNNC 电容器由于其小型化、轻量化和优异的电气性能，广泛应用于：
- 消费电子：适用于手机、平板电脑、笔记本电脑等设备中的信号处理和电源管理。
- 汽车电子：用于汽车的电子控制单元（ECU）、传感器和其他电子模块，提供稳定电源和信号过滤。
- 工业控制：在自动化设备及通信设备中用于电源供给和信号平滑。
- 医疗设备：在高可靠性的医疗电子设备中，确保设备的稳定性和信号完整性。
结论
整体来看，CL21B102KBCNNNC 多层陶瓷电容器以其高性能、可靠性和适用广泛的特性成为了现代电子设计中的重要元件。其优良的电气性能不仅可以在各种温度和电压条件下稳定工作，同时也能满足高频信号处理及滤波需求。对于电子工程师和设计师而言，了解 CL21B102KBCNNNC 的特性和应用场景，将有助于在各种高性能电子产品开发中，选择合适的电容器并确保产品质量与性能。
通过选择三星的这一款MLCC，开发者能够在稳定性和性能上得到保障，推动电子产品向更高的集成度和更小的体积发展，体现了现代电子科技的先进性与实用性。
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