WMSIC Electronic Components

CL10B104KB8VPJC MLCC CL10B104KB8VPJC

ModelCL10B104KB8VPJC
Package0603
BrandSAMSUNG
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
SAMSUNG CL10B104KB8VPJC
Type
SAMSUNG
Unit
Electronic Component
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
SAMSUNG
Electronic Component
CL10B104KB8VPJC
Electronic Component
1
Electronic Component
100nF
Package
0603
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.035g
Electronic Component
1
Electronic Component
BM0264216473
Electronic Component
X7R
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

三星CL10B104KB8VPJC 多层陶瓷贴片电容(MLCC)产品概述

一、产品基本信息

三星CL10B104KB8VPJC是一款通用型多层陶瓷贴片电容(MLCC),由三星电机(SAMSUNG ELECTRO-MECHANICS)生产,属于其主流商用MLCC系列。该产品针对滤波、耦合、旁路等基础电路需求设计,兼具高稳定性与紧凑尺寸,适配多种电子设备的表面贴装工艺。

二、核心性能参数

参数项 具体规格 说明 容值 100nF(104pF) 10×10⁴ pF,符合行业命名习惯 精度 ±10% 商用级标准精度,满足多数电路需求 额定电压 50V DC 直流工作电压上限,需注意交流降额 温度系数 X7R 介质材料特性,平衡容值稳定性与容量密度 封装类型 0603(公制1608) 英制命名:长度0.06英寸×宽度0.03英寸 材质 多层陶瓷(X7R介质) 叠层结构提升容量密度,陶瓷介质稳定性优于电解电容

三、封装与尺寸规格

CL10B104KB8VPJC采用0603表面贴装封装,具体尺寸(典型值):

  • 长度:1.6mm(0.063英寸)
  • 宽度:0.8mm(0.031英寸)
  • 厚度:0.8mm(部分批次0.75mm)
  • 引脚间距:0.5mm

该封装兼容常规回流焊工艺(温度范围220-260℃),适合高密度PCB布局,可通过自动化贴装设备批量生产,降低组装成本。

四、温度特性与稳定性

X7R介质是CL10B104KB8VPJC的核心特性之一,其温度性能表现为:

  • 工作温度范围:-55℃至+125℃(工业级温度区间)
  • 容值变化率:在全温度范围内控制在±15%以内(优于Y5V等低成本介质,略逊于NP0高精度介质)
  • 湿度影响:陶瓷介质抗湿性强,湿度变化对容值影响可忽略(符合IEC 60068-2-66标准)

该特性使其可稳定工作于户外设备、工业控制器等温度波动较大的场景。

五、典型应用场景

CL10B104KB8VPJC因参数均衡、尺寸紧凑,广泛应用于以下领域:

  1. 消费电子:智能手机、平板电脑、智能穿戴设备的电源滤波(如电池管理系统BMS)、信号耦合(音频/射频电路);
  2. 工业控制:PLC可编程控制器、传感器模块的旁路电容(抑制电磁干扰EMI);
  3. 通信设备:路由器、交换机的DC-DC转换器输入/输出滤波;
  4. 汽车电子:车载辅助系统(如仪表盘、中控屏)的低频滤波(需确认是否符合汽车级认证,部分批次支持AEC-Q200);
  5. 电源模块:小型开关电源的输出滤波,提升电压稳定性。

六、可靠性与品质保障

三星MLCC的生产工艺保障了CL10B104KB8VPJC的可靠性:

  • 环保合规:符合RoHS 2.0、REACH标准,无铅无卤;
  • 寿命表现:典型工作寿命≥10万小时(在额定电压、25℃环境下);
  • 抗振动性能:通过IEC 60068-2-6振动测试(10-2000Hz,加速度1g),可承受运输与使用中的振动;
  • 一致性:批量生产参数偏差小,同一批次容值、电压一致性≥98%,降低电路调试难度。

七、选型与替代参考

若需替代或扩展选型,可参考以下方案:

  • 同品牌替代:三星CL10B104KB8NNNC(封装、参数一致,后缀差异为包装形式);
  • 跨品牌替代:村田GRM188R61C104KA73D(0603封装、X7R、50V、100nF±10%)、TDK C1005X7R104K500(同参数);
  • 注意事项:替代时需确认封装尺寸、额定电压、温度系数完全匹配,避免交流电路中电压降额不足(交流峰值电压需≤额定电压的70%)。

CL10B104KB8VPJC作为三星商用MLCC的经典型号,以平衡的性能、可靠的品质成为电子设计中的常用选择,适配多数中低端至中端电子设备的基础电路需求。

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