WMSIC Electronic Components

CL32A476KPJNNNE MLCC CL32A476KPJNNNE

ModelCL32A476KPJNNNE
Package1210
BrandSAMSUNG
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
SAMSUNG CL32A476KPJNNNE
Type
SAMSUNG
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SAMSUNG
Electronic Component
CL32A476KPJNNNE
Electronic Component
1
Electronic Component
47uF
Package
1210
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.167g
Electronic Component
1
Electronic Component
BM0264356885
Electronic Component
X5R
Voltage
10V
Electronic Component
Electronic Component
Electronic Component
1000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

三星CL32A476KPJNNNE 多层陶瓷贴片电容(MLCC)产品概述

一、产品核心身份与定位

三星CL32A476KPJNNNE是一款商业级多层陶瓷贴片电容(MLCC),属于三星MLCC产品线中的中容值、小封装型号,专为低压电路的滤波、耦合、旁路等场景设计。该型号依托三星成熟的陶瓷材料与叠层工艺,在1210(英制)紧凑封装下实现47μF大容量,兼顾温度稳定性与空间效率,是消费电子、IoT终端等领域的主流选型之一。

二、关键参数精准解析

该型号的核心参数可通过型号编码与官方规格对应,具体如下:

参数类别 具体参数 型号编码对应 容值 47μF 编码中“476”(47×10⁶pF) 精度 ±10% 编码中“K”(精度等级) 额定电压(DC) 10V 编码中“J”(电压等级) 温度系数 X5R 编码中“X”(温度特性) 封装尺寸 1210(英制:3.2×2.5mm) 编码中“32”(三星封装代码) 端接类型 镍/锡镀层(Ni/Sn) 编码中“NN”(端接标识)

其中,X5R温度特性是该型号的核心亮点:工作温度范围为-55℃~+85℃,容值变化率控制在±15%以内,满足大多数室内、户外常温场景的稳定性需求。

三、核心特性与竞争优势

  1. 小封装大容量的空间效率
    1210封装(3.2×2.5mm)在同尺寸MLCC中实现47μF@10V的容值突破,相比传统铝电解电容体积缩小70%以上,可显著降低PCB布局的空间占用,适配智能手机、智能手表等便携设备的紧凑设计。

  2. 稳定的温度与电压特性
    X5R材料避免了NPO(温度系数稳定但容值低)与Y5V(容值高但温度变化大)的短板,在-55℃~+85℃范围内容值波动≤±15%;同时额定10V电压适配低压电路(如3.3V/5V系统),无过压风险。

  3. 高可靠性与焊接兼容性
    端接采用镍/锡双层镀层,焊接时与PCB焊盘结合力强,回流焊峰值温度(240~260℃)下无开裂风险;三星的叠层工艺确保批次一致性,电容值偏差控制在±10%内,可减少电路调试成本。

  4. 环保合规性
    符合RoHS 2.0、REACH等全球环保法规,不含铅、镉等有害物质,适配出口型电子设备的认证需求。

四、典型应用场景

该型号的参数特性决定了其广泛的应用范围,核心场景包括:

  1. 消费电子终端
    智能手机、平板电脑的电源滤波(如电池管理系统BMS)、音频耦合电路;智能手表的传感器模块旁路电容。

  2. IoT与智能家居
    智能门锁、温湿度传感器的控制电路滤波;智能音箱的电源回路耦合,适配低功耗、小体积的设计要求。

  3. 工业控制模块
    小型PLC(可编程逻辑控制器)的输入输出滤波;工业传感器(如压力/流量传感器)的信号耦合,满足-40℃~+85℃的工业环境温度需求。

  4. 车载信息娱乐系统
    车载中控屏、导航设备的低压电源滤波(注:需确认批次是否符合AEC-Q200车规,商业级型号适用于非安全关键场景)。

五、选型与使用注意事项

  1. 电压降额设计
    实际工作电压建议不超过额定电压的80%(即≤8V),避免直流偏置导致容值衰减(X5R容值随偏置电压升高略有下降,三星 datasheet 中提供偏置特性曲线)。

  2. 温度范围限制
    严禁在+85℃以上环境长期工作,否则容值变化率将超过±15%,影响电路性能;低温场景需确保温度不低于-55℃,避免陶瓷材料脆化。

  3. 焊接工艺规范
    采用回流焊工艺,峰值温度控制在245±5℃,时间不超过10秒;禁止手工焊接(热冲击易导致电容开裂),如需返修需使用热风枪低温模式。

  4. 容值验证
    批量使用前建议抽样测试容值(如用LCR表在25℃、1kHz下测试),确保符合±10%精度要求。

六、总结

三星CL32A476KPJNNNE是一款高性价比的中容值MLCC,以1210小封装实现47μF大容量,兼顾温度稳定性与可靠性,适配消费电子、IoT、工业控制等多领域的低压电路需求。其核心优势在于“小体积+稳定性能”,是替代传统铝电解电容、提升电路集成度的理想选型。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.