Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CL21B224KCFSFNE是三星(SAMSUNG)生产的一种多层陶瓷电容器(MLCC),采用表面贴装技术(SMD),其封装尺寸为0805,约为2.00mm x 1.25mm。这款电容器专为现代电子电路设计而成,具有良好的性能和灵活的应用场景,非常适合对空间和性能要求严格的电子设备。
CL21B224KCFSFNE的电容量为220nF,这一数值使其在各种电路中充当旁路电容器、滤波电容或耦合电容等功能时,能够有效提高电路的稳定性与传输效率。其额定电压为100V,适用于中高电压的电路场合。兼容的工作温度范围从-55°C到125°C,保证了其在不同环境下的可靠性和稳定性。
作为一款多层陶瓷电容器,CL21B224KCFSFNE采用X7R材料。这种材料具有较好的温度稳定性,能够在高温条件下保持相对一致的电容值,适合用于对温度变化敏感的电路设计。同时,X7R材料的介电常数较高,能够在较小的体积内提供所需的电容值,非常适合现代小型化电子产品的需求。
CL21B224KCFSFNE广泛应用于消费电子、汽车电子、工业设备以及通信设备领域。由于其板弯曲敏感特性,适合用于柔性电路板(FPC)以及需要承受环境压力变化的应用项目。在消费电子中,常见的应用包括手机、平板电脑、音响设备等,能够有效提升电源管理和信号传输的质量。
在汽车电子领域,CL21B224KCFSFNE可用于控制单元(ECU)、传感器及其它电子设备,由于其良好的高温稳定性和抗环境变化能力,很适合在车载电子系统中使用。此外,由于要求通用性与可靠性的通信设备中也可应用此电容器,显著提高电路的性能和可靠性。
CL21B224KCFSFNE是一款性能优异的表面贴装多层陶瓷电容器,具有225nF的电容值、100V的额定电压以及-55°C到125°C的宽广工作温度范围,适应性强。其优越的温度系数(X7R)使其在许多对温度变化敏感的领域表现出色,是现代电子设备设计中不可或缺的基础元器件之一。由于其小巧的封装尺寸与较高的电气性能,CL21B224KCFSFNE在未来的电子产品开发中,将继续发挥重要作用。
通过对其性能、应用及材料特性的全面了解,工程师和设计师可以更好地选择和利用这一优秀的电子元器件,以实现高效、可靠的电路设计。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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