WMSIC Electronic Components

CL21B225KAFVPNE MLCC CL21B225KAFVPNE

ModelCL21B225KAFVPNE
Package0805
BrandSAMSUNG
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
SAMSUNG CL21B225KAFVPNE
Type
SAMSUNG
Unit
Electronic Component
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
SAMSUNG
Electronic Component
CL21B225KAFVPNE
Electronic Component
1
Electronic Component
2.2uF
Package
0805
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.034g
Electronic Component
1
Electronic Component
BM0257647808
Electronic Component
X7R
Voltage
25V
Electronic Component
Electronic Component
Electronic Component
2000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CL21B225KAFVPNE 产品概述

产品简介 CL21B225KAFVPNE 是三星电机(Samsung Electro-Mechanics)推出的一款高性能多层陶瓷电容器(MLCC),属于CL系列。该产品采用表面贴装技术(SMT),封装尺寸为0805(2012公制),适用于各种高密度电子设备。其额定电压为25V,电容值为2.2µF,容差为±10%,温度系数为X7R,工作温度范围为-55°C至125°C。此外,该产品符合AEC-Q200标准,专为汽车级应用设计,确保在严苛环境下的可靠性和稳定性。

主要特性

  1. 高电容值:CL21B225KAFVPNE 提供2.2µF的电容值,适用于需要高电容的应用场景。
  2. 宽工作温度范围:该电容器可在-55°C至125°C的温度范围内稳定工作,适合各种环境条件。
  3. 高可靠性:符合AEC-Q200标准,确保在汽车等严苛环境下的高可靠性和长寿命。
  4. 紧凑尺寸:封装尺寸为0805(2012公制),尺寸为0.079"长 x 0.049"宽(2.00mm x 1.25mm),厚度最大为0.053"(1.35mm),适合高密度PCB设计。
  5. 低ESR和ESL:多层陶瓷结构设计,提供低等效串联电阻(ESR)和低等效串联电感(ESL),适用于高频应用。

应用领域 CL21B225KAFVPNE 广泛应用于各种电子设备中,特别是需要高可靠性和高性能的汽车电子系统。其主要应用包括:

  1. 汽车电子:发动机控制单元(ECU)、车载信息娱乐系统、车身控制模块等。
  2. 消费电子:智能手机、平板电脑、笔记本电脑等便携式设备。
  3. 工业控制:工业自动化设备、电源管理系统、传感器接口等。
  4. 通信设备:基站、路由器、交换机等通信基础设施。

技术规格

  • 制造商:Samsung Electro-Mechanics
  • 系列:CL
  • 包装:卷带(TR)
  • 零件状态:有源
  • 容差:±10%
  • 额定电压:25V
  • 温度系数:X7R
  • 工作温度:-55°C ~ 125°C
  • 等级:AEC-Q200
  • 应用:汽车级
  • 安装类型:表面贴装,MLCC
  • 封装/外壳:0805(2012 公制)
  • 尺寸:0.079" 长 x 0.049" 宽(2.00mm x 1.25mm)
  • 厚度(最大值):0.053"(1.35mm)
  • 电容:2.2µF

优势与特点

  1. 高电容密度:在紧凑的封装尺寸内提供高电容值,满足现代电子设备对高密度电容的需求。
  2. 优异的温度稳定性:X7R温度系数确保在宽温度范围内的电容稳定性,适合各种环境条件。
  3. 高可靠性:符合AEC-Q200标准,经过严格的质量控制和测试,确保在汽车等严苛环境下的高可靠性。
  4. 低ESR和ESL:多层陶瓷结构设计,提供低等效串联电阻(ESR)和低等效串联电感(ESL),适用于高频应用。
  5. 易于自动化生产:表面贴装技术(SMT)和卷带包装(TR)便于自动化生产,提高生产效率和一致性。

结论 CL21B225KAFVPNE 是一款高性能、高可靠性的多层陶瓷电容器,适用于各种高密度电子设备,特别是汽车电子系统。其高电容值、宽工作温度范围、紧凑尺寸和符合AEC-Q200标准的特点,使其成为汽车级应用的理想选择。无论是在汽车电子、消费电子、工业控制还是通信设备中,CL21B225KAFVPNE 都能提供卓越的性能和可靠性,满足现代电子设备对高性能电容器的需求。

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