WMSIC Electronic Components

CL32B106KMVNNWE MLCC CL32B106KMVNNWE

ModelCL32B106KMVNNWE
Package1210
BrandSAMSUNG
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 163575

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Technical data

Product details

18 specifications

Core information

Product name
SAMSUNG CL32B106KMVNNWE
Type
SAMSUNG
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SAMSUNG
Electronic Component
CL32B106KMVNNWE
Electronic Component
1
Electronic Component
10uF
Package
1210
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.162g
Electronic Component
1
Electronic Component
BM0266123636
Electronic Component
X7R
Voltage
63V
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

三星CL32B106KMVNNWE陶瓷电容器产品概述

一、核心参数与规格标识

三星CL32B106KMVNNWE属于三星陶瓷电容器系列,核心参数与型号标识对应清晰:

  • 容值:10μF(型号中“106”为容值代码,即10×10⁶ pF=10μF);
  • 精度:±10%(“K”为精度标识,符合IEC国际电工委员会标准);
  • 额定电压:63V(“M”对应63V额定值,适配多数中低压电路场景);
  • 温度系数:X7R(EIA标准分类,温度特性明确);
  • 封装:1210英制(对应3225公制,尺寸3.2mm×2.5mm);
  • 品牌:SAMSUNG(三星),行业主流供应商,产品一致性与可靠性经市场验证。

二、封装形式与物理特性

该电容采用表面贴装(SMD)1210封装(公制3225),物理尺寸为:长3.2mm±0.2mm、宽2.5mm±0.2mm、厚≤1.6mm,属于紧凑式封装,可兼容高密度PCB布局设计,适配自动贴装设备(SMT)批量生产。

端电极采用镍底层+锡镀层结构,兼具焊接可靠性与抗氧化性,符合RoHS 2.0、REACH等环保指令,无铅无卤,适配绿色制造工艺要求。

三、材料特性与温度稳定性

采用X7R温度系数陶瓷介质,其温度特性符合EIA标准:在**-55℃至+125℃宽温范围**内,容值变化率≤±15%(实际产品精度可稳定在±10%以内)。

相比Y5V(高容值但温度稳定性差),X7R更适合对温度敏感的电路;相比NP0(C0G,超低温系数但容值小),X7R兼顾温度稳定性与容值密度,可实现10μF中等容值,平衡性能与成本。

四、典型应用场景

基于参数与特性,该电容广泛应用于以下场景:

  1. 电源滤波:开关电源、线性电源的输入/输出滤波,滤除低频纹波与高频噪声,63V额定电压覆盖多数消费电子、工业电源;
  2. 信号耦合:音频电路、通信接口(UART、SPI)的信号耦合,X7R的温度稳定性避免信号失真;
  3. 旁路电容:CPU、MCU、FPGA等数字电路的电源旁路,快速滤除电源线上高频干扰,提升抗噪性能;
  4. 工业控制:PLC、传感器模块等工业设备,宽温范围适配工业环境温度波动;
  5. 车载辅助电路:车载音响、仪表板等非安全关键汽车电子(部分批次符合AEC-Q200标准,可用于辅助系统)。

五、性能优势与可靠性

  1. 宽温稳定:-55~+125℃区间内,容值变化小,适配极端温度场景;
  2. 高可靠性:三星严格工艺管控,产品失效率低,部分批次通过AEC-Q200汽车级认证;
  3. 焊接兼容:端电极适配回流焊、波峰焊,焊接后无虚焊、脱落风险;
  4. 电压裕量:63V额定电压比16V/25V电容高,可应对电路电压尖峰,延长寿命;
  5. 成本平衡:X7R介质兼顾性能与成本,适合大规模商用场景。

六、选型与使用注意事项

  1. 电压降额:实际工作电压建议≤额定电压的80%(即≤50.4V),避免过压失效;
  2. 焊接工艺:回流焊峰值温度≤245℃,时间≤10秒;波峰焊温度≤260℃,时间≤5秒,防止热冲击;
  3. 存储条件:存储于25℃±5℃、湿度≤60%干燥环境,开封后12个月内使用,避免吸潮影响焊接;
  4. 温度适配:虽标称-55+125℃,实际工作建议控制在-40+105℃,确保长期稳定;
  5. 应用匹配:若需超低温稳定性(射频电路)选NP0;若需大容值(100μF+)选Y5V/X5R。

该产品凭借三星品牌优势与X7R介质特性,成为消费电子、工业控制等领域的主流陶瓷电容选型之一。

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