Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
CL10B471KB8NNNC MLCC CL10B471KB8NNNC
Configuration
1 options
Configuration
Option 163579
Availability on request
Technical data
Product details
18
specifications
Core information
- Product name
- SAMSUNG CL10B471KB8NNNC
- Type
- SAMSUNG
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SAMSUNG
- Electronic Component
- CL10B471KB8NNNC
- Electronic Component
- 1
- Electronic Component
- 470pF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.035g
- Electronic Component
- 1
- Electronic Component
- BM0264356236
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
三星CL10B471KB8NNNC多层陶瓷贴片电容（MLCC）产品概述
一、产品核心身份与定位
三星CL10B471KB8NNNC是一款通用型多层陶瓷贴片电容（MLCC），属于三星标准MLCC系列，针对电子电路中滤波、耦合、去耦等基础功能设计，兼顾容值密度与温度稳定性，覆盖消费电子、小型工业控制等多场景，是电子设备中应用最广泛的被动元件之一。
二、关键电气性能参数解析
该型号参数与行业标注规则对应清晰，核心指标如下：
- 容值：470pF（型号中“471”为三位标注，前两位“47”为有效数，第三位“1”为10¹倍率，即47×10¹=470pF）；
- 精度：±10%（型号中“K”为精度档，行业通用K档代表±10%）；
- 额定电压：50V DC（型号中“B”为电压档，三星MLCC系列中B档对应50V直流额定电压）；
- 介质材质：X7R（MLCC中应用最广的中温稳定型陶瓷介质）。
三、温度特性与稳定性分析
X7R材质是该型号的核心性能优势：其温度系数范围为**-55℃至+125℃**，在此区间内容值变化率控制在±15%以内，远优于Y5V等低成本材质（Y5V容值变化可达±20%~-82%）。这一特性可避免电路因温度波动导致容值漂移，比如电源滤波电路中，稳定的容值能保证滤波效果一致性，适合户外设备、车载辅助电路等温度变化较大的场景。
四、封装与机械可靠性
采用0603封装（英制尺寸，对应公制1608：长1.6mm×宽0.8mm），是小型化设备的主流贴片封装：
- 适配SMT自动化生产，支持回流焊、贴片焊接工艺，焊接可靠性符合IEC 60068-2环境测试标准；
- 陶瓷基体结合镍电极结构，抗振动（10g~2000Hz）、抗冲击性能良好，满足小型家电、工业控制模块的机械要求；
- 尺寸紧凑，适合手机、智能手表等便携设备的高密度布线设计。
五、典型应用场景
因参数均衡，该型号覆盖多类电子设备：
- 消费电子：手机主板电源去耦、信号耦合，平板、智能音箱音频滤波；
- 小型家电：遥控器、扫地机器人控制电路滤波，小型厨电电源模块；
- 工业控制：小型PLC、传感器节点信号处理，低功率工业模块电源滤波；
- 通信设备：小型路由器、无线耳机模块射频耦合（470pF容值在中高频段损耗可接受）；
- 车载辅助电路：车载充电器、氛围灯控制模块（需确认衍生型号是否符合AEC-Q200，三星部分型号支持车载级）。
六、品牌与品质保障
作为三星电子标准MLCC产品，具备以下优势：
- 符合RoHS 2.0、REACH等环保法规，无铅无镉，满足全球市场准入；
- 三星全球产能稳定，批量供货一致性好，避免参数离散导致良率波动；
- 提供完整datasheet与技术支持，方便电路设计选型与失效分析，适合量产项目。
该型号凭借参数均衡、成本可控、稳定性强的特点，成为电子设计中高频选用的通用MLCC之一。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
