WMSIC Electronic Components

CL10A225KP8NNNC MLCC CL10A225KP8NNNC

ModelCL10A225KP8NNNC
Package0603
BrandSAMSUNG
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Availability on request

Technical data

Product details

20 specifications

Core information

Product name
SAMSUNG CL10A225KP8NNNC
Type
SAMSUNG
Unit
Electronic Component
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
SAMSUNG
Electronic Component
CL10A225KP8NNNC
Electronic Component
1
Electronic Component
2.2uF
Package
0603
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.035g
Electronic Component
1
Electronic Component
BM69413952
Electronic Component
X5R
Voltage
10V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:SAMSUNG CL10A225KP8NNNC 贴片电容

一、产品基本信息

SAMSUNG CL10A225KP8NNNC 是一款表面贴装的多层陶瓷电容器(MLCC),其主要参数包括电容量2.2μF、额定电压10V、容差±10%、温度系数X5R、工作温度范围为-55°C至85°C。作为0603(1608公制)封装的元器件,该电容的尺寸为0.063" x 0.031"(1.60mm x 0.80mm),最大厚度为0.035"(0.90mm)。

二、产品特性

  1. 电气性能

    • 电容量与额定电压:该电容器的2.2μF电容量适合多种应用,能够有效储存电能并在需要时释放,10V的额定电压使其适用于低电压电路的设计。
    • 容差:±10%的容差使其在电路设计时有足够的灵活性,适配不同的电气要求。
  2. 温度特性

    • 温度系数X5R:此电容的温度系数为X5R,这意味着其电容量在-55°C到85°C范围内变化较小,适合在宽温度环境下使用,能保持稳定的电气性能。
    • 工作温度范围:-55°C至85°C的工作温度范围使其能够适应高温、高湿和低温等多种环境,增加了其适用的应用领域。
  3. 封装与安装

    • 0603封装:0603(1608公制)封装尺寸非常适合现代电子产品的紧凑设计,适合用于高密度电路板上,有助于节省空间,提高产品的集成度。
    • 表面贴装:作为一种表面贴装元件(SMD),其安装方式简化了生产流程,提高了自动化组装的效率,同时确保了良好的电气性能和热管理。

三、应用场景

SAMSUNG CL10A225KP8NNNC 贴片电容广泛应用于以下几个领域:

  1. 消费电子:在各种手机、平板电脑、笔记本电脑等消费电子产品中,该电容可用于滤波、去耦合、噪声抑制等应用,提高设备的稳定性和性能。

  2. 汽车电子:随着汽车智能化和电子化的不断发展,这款电容器可应用于汽车控制单元、传感器电路及其辅助系统,以确保在恶劣环境下长时间稳定工作。

  3. 工业设备:在工业自动化和控制系统中,该电容器适合用于电源管理、信号处理及脉冲电源中,能够提高设备的可靠性和响应速度。

  4. 通讯设备:在网络通信设备如路由器、交换机等中,该元器件能够用于信号耦合、频率选择以及电源平滑,大大提升通信性能。

四、总结

SAMSUNG CL10A225KP8NNNC 贴片电容凭借其出色的电气特性、广泛的工作温度范围和0603封装的优越性,成为现代电子设备设计中的重要元件。其在消费电子、汽车电子、工业设备及通讯设备等多个领域的广泛应用,不仅提升了产品的性能和稳定性,同时也顺应了电子产品向小型化、集成化的发展趋势。选择CL10A225KP8NNNC,将为您的电子设计带来更高的效率和可靠性,是提升产品竞争力的优质选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.