Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CL05A225KA5NUNC 是一款由三星(SAMSUNG)公司生产的表面贴装多层陶瓷电容(MLCC),广泛应用于各种电子设备中。该电容以其紧凑的尺寸、稳定的性能和广泛的应用范围而著称,适用于通用电子电路中的滤波、去耦、储能等应用。
CL05A225KA5NUNC 是一款贴片电容,采用多层陶瓷技术制造,具有高电容密度和优异的电气性能。其封装形式为0402(1005公制),尺寸仅为1.00mm x 0.50mm,非常适合在空间受限的电路板上使用。该电容的额定电压为25V,电容值为2.2µF,容差为±10%,能够在广泛的温度范围内(-55°C至85°C)稳定工作。
CL05A225KA5NUNC 广泛应用于各种电子设备中,包括但不限于:
CL05A225KA5NUNC 采用0402(1005公制)封装,尺寸为1.00mm x 0.50mm,厚度最大为0.55mm。这种紧凑的封装形式使得该电容非常适合在空间受限的电路板上使用,同时便于自动化贴装生产。
三星(SAMSUNG)作为全球知名的电子元器件制造商,以其高质量和可靠性而闻名。CL05A225KA5NUNC 作为三星MLCC产品线的一部分,继承了三星一贯的高品质标准,确保了在各种应用中的优异表现。
CL05A225KA5NUNC 是一款高性能、高可靠性的表面贴装多层陶瓷电容,适用于广泛的电子应用。其紧凑的尺寸、高电容密度和优异的温度稳定性使其成为现代电子设备中的理想选择。无论是消费电子、通信设备、工业控制还是汽车电子,CL05A225KA5NUNC 都能提供稳定可靠的电容解决方案。
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Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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