WMSIC Electronic Components

CL10B563KB8NNNC MLCC CL10B563KB8NNNC

ModelCL10B563KB8NNNC
Package0603
BrandSAMSUNG
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 163586

Availability on request

Technical data

Product details

18 specifications

Core information

Product name
SAMSUNG CL10B563KB8NNNC
Type
SAMSUNG
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SAMSUNG
Electronic Component
CL10B563KB8NNNC
Electronic Component
1
Electronic Component
56nF
Package
0603
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.035g
Electronic Component
1
Electronic Component
BM0265828841
Electronic Component
X7R
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:CL10B563KB8NNNC

基本信息

CL10B563KB8NNNC 是由三星(SAMSUNG)公司制造的一款多层陶瓷电容器(MLCC),适用于表面贴装技术(SMT)。其设计旨在满足各类电子设备对电容器的高性能需求,广泛应用于消费电子、工业设备、汽车电子等领域。该产品在满足严格的性能指标的同时,还考虑到市场对小型化和高效能元器件的需求。

产品规格

  • 电容值:0.056μF,符合通用电容需求。
  • 额定电压:50V,适合大多数电子产品的工作电压范围。
  • 温度系数:采用X7R材料,具备优良的温度稳定性,工作温度范围可达-55°C至125°C,适应严苛的环境。
  • 容差:±10%,能够提供一定的设计灵活性。
  • 封装尺寸:0603(1608公制),长0.063"(1.60mm),宽0.031"(0.80mm),厚度最大值为0.035"(0.90mm),为表面贴装设计提供了极大的便利。

产品特性

CL10B563KB8NNNC 具有多个优越的特性,主要体现在以下几个方面:

  1. 高可靠性:X7R陶瓷材料使该电容器在不同温度和电压条件下保持良好的稳定性,尤其适合用于高温和高电压的工作环境中。

  2. 小型化设计:0603封装的设计使其在空间受限的应用中表现出色,如手机、平板电脑、智能穿戴设备等。在PCB设计中占据最小的空间,提高了整体布局的效率。

  3. 电气性能优良:该电容器能够提供低ESR(等效串联电阻)和高的振荡频率,适用于滤波、旁路及耦合等多种用途。

  4. 一致性与精度:具有一定的容差范围,确保在大批量生产中电气性能的一致性,便于大规模应用。

  5. 环境友好:作为陶瓷电容器,CL10B563KB8NNNC 不含铅和其他有害物质,符合ROHS标准,适合现代电子设备的环保要求。

应用场景

CL10B563KB8NNNC 的应用场景广泛,适合于:

  • 消费电子:如智能手机、平板电脑、LED背光模块等,需求小型化且性能可靠的电容器。
  • 汽车电子:用于电源管理系统、传感器及其他关键电路中,能够承受严格的温度和电压波动。
  • 工业应用:在自动化设备、传感器及控制系统中,可以为不同的电气通知和信号处理功能提供支持。
  • 通信设备:能够支持高频信号的耦合与解耦,广泛应用在基站、路由器等设备中。

总结

总之,CL10B563KB8NNNC 是一款在电特性和应用灵活性上表现优秀的表面贴装陶瓷电容器。其小巧的封装尺寸、高额定电压、优越的温度稳定性和环境友好的特点,使其在现代电子设计中愈加受到青睐。无论是在消费电子、工业设备还是高标准汽车电子领域,CL10B563KB8NNNC 都能为电子工程师和设计师提供可靠的解决方案,助力实现更高效能的电路设计。

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