Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
CL31A106KBHNNNE MLCC CL31A106KBHNNNE
Configuration
1 options
Configuration
26+
Availability on request
Technical data
Product details
20
specifications
Core information
- Product name
- SAMSUNG CL31A106KBHNNNE
- Type
- SAMSUNG
- Unit
- Electronic Component
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- SAMSUNG
- Electronic Component
- CL31A106KBHNNNE
- Electronic Component
- 1
- Electronic Component
- 10uF
- Package
- 1206
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.072g
- Electronic Component
- 1
- Electronic Component
- BM69414957
- Electronic Component
- X5R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 2000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：SAMSUNG CL31A106KBHNNNE 贴片电容
1. 产品简介
SAMSUNG（三星）CL31A106KBHNNNE是一款高性能的多层陶瓷电容器（MLCC），其基本电参数为值为10µF，额定电压为50V，采用X5R温度系数，具有良好的电气特性和可靠性。该电容器以1206（3216公制）封装形式提供，适用于表面贴装应用，是一种广泛应用于各类电子设备的通用电容。
2. 关键参数
- 电容值：10µF，适用于需要中等能量存储的电路。
- 电压额定值：50V，能在高压环境中稳定工作，适合用于电源滤波、耦合和旁路等应用。
- 容差范围：±10%，确保电容的实际容量在使用过程中保持较高的一致性。
- 温度系数：X5R，此种温度系数的电容在温度变化（-55°C至85°C）时，具有良好的电容值稳定性，特别适合在变化的温度条件下工作而不会显著降额。
- 工作温度范围：-55°C至85°C，采用严格的工业标准，使其能够在极端环境下正常工作。
- 封装类型：1206（3216公制），小巧的体积使得其在表面贴装电路中具有广泛的应用。
3. 应用场景
CL31A106KBHNNNE展现出优异的性能，使其适合广泛的应用领域，包括但不限于：
- 消费类电子产品：如智能手机、平板电脑、音响系统等，作为电源铺设和信号耦合的关键元件。
- 工业设备：在需要高可靠性的工业控制和自动化系统中，提供稳定的电气性能。
- 汽车电子：如车载娱乐系统和安全系统中，对高温和高电压的抗性非常重要。
- 通讯设备：在信号处理和电源管理中起到关键作用的核心组件。
- 计算机硬件：能够用于主板和开关电源中的电源滤波与旁路电路。
4. 性能优势
- 可靠性和稳定性：采用X5R材料，确保在温度和电压变化下的稳定性，减少因环境因素引起的性能下降。
- 高密度和小体积：1206封装使其能够在空间有限的设计中占据较小的面积，极大地提高了电路的集成度。
- 低漏电流：相较于其他类型电容，MLCC的漏电流显著降低，增强了整体电源效能，是现代电子设计的重要组成部分。
- 通用性：适用于多种场合，不论是对高负载的电路还是较为轻载的环节，均能表现出色。
5. 结论
SAMSUNG CL31A106KBHNNNE贴片电容凭借其出色的电气特性和广泛的应用范围，在现代电子设计中扮演着不可或缺的角色。其稳定、可靠的性能和小巧的封装设计使其成为多种电子设备的理想选择。在复杂和苛刻的工作环境中，CL31A106KBHNNNE能够持续满足用户的高标准、严要求，充分展现出三星在电子元器件领域的领先实力。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
