WMSIC Electronic Components

ST ZM4733APF Zener diode ZM4733APF

ModelZM4733APF
PackageLL-41
BrandST
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ST ZM4733APF
Type
ST
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ST
Electronic Component
ZM4733APF
Electronic Component
1
Package
LL-41
Electronic Component
Zener Diode
Electronic Component
±5%
Electronic Component
0.131g
Electronic Component
1
(Zzk)
550Ω
(Zzt)
7Ω
Electronic Component
BM0225730362
Diode
1
Current(Ir)
10uA
Power Dissipation(Pd)
1W
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ZM4733APF 5.1V 1W(LL-41)产品概述

一、概述

ZM4733APF 是一款标称稳压值为 5.1V 的低功耗稳压二极管,封装为 LL-41 轴向玻璃封装,适用于通孔安装的基准与过压钳位场合。产品品牌为 ST(先科),额定耗散功率为 1W,适合用作小功率基准源、并联稳压或峰值钳位元件。

二、主要电气参数

  • 标称稳压值(Vz):5.1V(±5% 精度)
  • 额定耗散功率(Pd):1W(在规定散热条件下)
  • 反向电流(Ir,漏电流):10 μA(在规定反向电压下)
  • 低电流阻抗(Zzk):550 Ω(低电流区域的阻抗)
  • 测试/稳态阻抗(Zzt):7 Ω(在规定测试电流下的动态阻抗)

以上参数用于评估电路中稳压精度、负载调节与噪声特性。特别注意 Zzk 与 Zzt 分别反映在低电流与工作电流下的阻抗差异,对设计偏置电流有直接影响。

三、典型应用

  • 作为 5.1V 参考源:为小型传感器、比较器或 ADC 提供基准电压。
  • 并联稳压/分压补偿:与限流电阻配合,用于低成本稳压电路。
  • 过压钳位与浪涌保护:在输入突波或反向瞬态时起保护作用。
  • 偏置与检测电路:为放大器或逻辑电路提供稳定偏置电压。

四、使用建议与计算

  • 限流电阻 R 的选择:R = (Vin - Vz) / Iz,其中 Iz 为流过稳压管的工作电流。
  • 功率校核:稳压管功耗 Pz = Vz × Iz,应满足 Pz ≤ Pd(并考虑温升与环境)。例如:若 Vin = 12V,选 Iz = 50 mA,则 R ≈ 138 Ω,Pz ≈ 5.1 × 0.05 = 0.255 W,远低于 1W。
  • 最大允许电流近似:Iz_max ≈ Pd / Vz ≈ 1 W / 5.1 V ≈ 196 mA,但实际应考虑封装散热和环境温度,通常建议在稳态工作时留裕量(如 ≤50–100 mA)。
  • 布局与散热:LL-41 为轴向玻璃封装,散热依赖引线与 PCB,避免紧邻高发热元件,必要时在电路板上留散热开阔区或采用散热片/铜箔加宽引脚散热路径。
  • 注意反向漏流与温漂:低电流下 Zzk 较大,稳压点受电流变化影响明显;反向漏流在高温下会上升,应在设计中考虑温度系数与精度要求。

五、封装与可替代型号

  • 封装:LL-41(轴向玻璃,通孔,常见于 DO-41 类封装尺寸)。
  • 常见可替代型号(需逐项核对具体参数):1N4733A、BZT52C5V1 等 5.1V、1W 级别的稳压二极管。选择替代品时请核对稳压电压容差、阻抗、漏电流与散热能力。

六、结论

ZM4733APF(5.1V,1W,LL-41)适合用在小功率基准、并联稳压与浪涌钳位等场合。设计时应按最大耗散功率和动态阻抗选择偏置电流,注意散热与工作环境对稳压性能和可靠性的影响。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.