WMSIC Electronic Components

ST BAT54S Schottky diode BAT54S

ModelBAT54S
PackageSOT-23
BrandST
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ST BAT54S
Type
ST
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ST
Electronic Component
BAT54S
Electronic Component
1
Package
SOT-23
Electronic Component
Schottky Diode
Electronic Component
0.028g
Electronic Component
1
Electronic Component
BM0225351911
Current
200mA
Diode
1
Current(Ir)
2uA@25V
(Vf)
800mV@100mA
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BAT54S 产品概述

一、产品简介

BAT54S 为肖特基势垒二极管系列中的表贴器件,适用于小电流、高速切换与功率受限的整流与保护场合。该器件由先科(ST)品牌以 SOT-23 封装提供,体积小、重量轻,便于自动贴装与高密度 PCB 设计。典型工作结温范围为 -55℃ 至 +150℃,可满足工业级温度要求。

二、主要参数

  • 直流反向耐压 (Vr):30 V
  • 正向压降 (Vf):800 mV @ 100 mA
  • 最大整流电流:200 mA(平均)
  • 非重复峰值浪涌电流 (Ifsm):600 mA(单次脉冲)
  • 反向电流 (Ir):2 μA @ 25 V(室温)
    这些参数说明 BAT54S 在中低功率整流与保护应用中具有良好的均衡性能。

三、主要特性与优势

  • 低正向压降:在低到中等电流下提供较低的压降,减少功耗与功率损耗。
  • 快速切换:肖特基结构无显著反向恢复电荷,适合高速开关场合。
  • 宽温度范围:-55℃~+150℃ 的工作结温增强了在恶劣环境下的可靠性。
  • 小型封装:SOT-23 适合高密度 SMT 布局,利于便携与消费类产品设计。

需要注意的是:肖特基二极管的反向漏电随温度显著上升,在高温下 Ir 会增加,设计中应考虑温升与漏电影响。

四、典型应用场景

  • 低压电源整流与续流路径(小功率开关电源、USB 电源前端)
  • 反接与极性保护(电池或外部电源接口)
  • 信号钳位与保护(接口隔离与 ESD 旁路)
  • 混合信号电路中的快速切换二极管

五、PCB 布局与可靠性建议

  • 保持焊盘与热沉路径完整,利用短而宽的走线减少寄生电阻。
  • 若需散热提升,可在焊盘下方设计过孔或扩大铜箔面积(视 SOT-23 允许)。
  • 对于高脉冲或高频场合,关注 Ifsm 与峰值功耗,做好热工裕量与退火工艺控制。
  • 在高温环境中,应按厂商温度-漏电特性对 Ir 进行热降额设计。

六、选型与替代建议

选择 BAT54S 时,请以实际工作电流与工作电压为准,若系统对正向压降或反向耐压有更高要求,可考虑额定电流或耐压更高的肖特基型号,或采用肖特基与普通整流搭配的解决方案。最终选型请参照厂商完整数据手册,关注 Vf(随电流)、Ir(随温度)与热阻等关键曲线。

如需进一步资料(封装图、引脚定义、典型特性曲线或 PCB 焊接建议),建议索取并严格按照先科(ST)提供的最新数据表进行验证与设计验证。

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