Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ST MM3Z6V2 Zener diode MM3Z6V2
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- ST MM3Z6V2
- Type
- ST
- Minimum package
- 3000
Technical parameters
- Electronic Component
- ST
- Electronic Component
- MM3Z6V2
- Electronic Component
- 1
- Package
- SOD-323
- Electronic Component
- Zener Diode
- Electronic Component
- 0.223g
- Electronic Component
- 1
- (Zzt)
- 50Ω
- Electronic Component
- BM0230004874
- Diode
- 1
- Current(Ir)
- 1uA@3V
- Power Dissipation(Pd)
- 300mW
- Electronic Component
- 5.8V~6.6V
- Electronic Component
- 3000
- Electronic Component
- 6.2V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MM3Z6V2 产品概述
1. 产品简介
MM3Z6V2 是一款由 ST（先科）公司生产的稳压二极管，采用独立式配置，封装形式为 SOD-323。该器件主要用于电路中的电压稳定和保护，能够在特定的电压范围内提供稳定的输出电压。其标称稳压值为 6.2V，实际稳压值范围为 5.8V 至 6.6V，适用于多种电子设备和电路设计。
2. 主要特性
- 稳压值：标称值为 6.2V，实际范围在 5.8V 至 6.6V 之间。
- 反向电流：在 3V 反向电压下，反向电流仅为 1μA，表现出极低的漏电流特性。
- 功率耗散：最大功率耗散为 300mW，适合低功耗应用。
- 阻抗：动态阻抗（Zzt）为 50Ω，确保在稳压过程中具有良好的响应速度。
- 封装：采用 SOD-323 封装，体积小巧，适合高密度 PCB 布局。
3. 应用场景
MM3Z6V2 广泛应用于需要稳定电压的电子电路中，包括但不限于以下领域：
- 电源管理：用于稳压电源模块，确保输出电压的稳定性。
- 信号处理：在模拟和数字信号处理电路中，提供稳定的参考电压。
- 通信设备：在无线通信设备中，用于保护敏感元件免受电压波动的影响。
- 消费电子：在手机、平板电脑、数码相机等消费电子产品中，用于电压调节和保护。
4. 技术参数
- 反向电压（Vr）：最大反向电压为 6.2V。
- 正向电流（If）：最大正向电流为 200mA。
- 工作温度范围：-55°C 至 +150°C，适应各种环境条件。
- 存储温度范围：-55°C 至 +150°C，确保长期存储的可靠性。
5. 设计考虑
在设计使用 MM3Z6V2 的电路时，需要考虑以下因素：
- 散热：虽然功率耗散较低，但在高环境温度或高负载条件下，仍需考虑散热问题。
- 布局：由于采用 SOD-323 封装，布局时应确保足够的空间和适当的散热路径。
- 保护：在电路中加入适当的保护措施，防止过压、过流等异常情况对器件造成损害。
6. 可靠性
MM3Z6V2 经过严格的质量控制和可靠性测试，确保在各种应用场景下都能稳定工作。其低反向电流和高动态阻抗特性，使其在长时间运行中仍能保持优异的性能。
7. 环境友好
ST 公司致力于环保生产，MM3Z6V2 符合 RoHS 指令，不含有害物质，符合现代电子产品对环保的要求。
8. 总结
MM3Z6V2 是一款高性能的稳压二极管，具有稳定的输出电压、低反向电流和高动态阻抗等优点。其小巧的封装和广泛的应用场景，使其成为电子设计中不可或缺的元件。无论是电源管理、信号处理还是通信设备，MM3Z6V2 都能提供可靠的电压稳定和保护功能，确保电路的稳定运行。
通过以上概述，可以看出 MM3Z6V2 在电子设计中的重要性和广泛应用。其优异的性能和可靠性，使其成为工程师在设计电路时的首选元件之一。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
