WMSIC Electronic Components

ST MMBTRC101SS digital transistor MMBTRC101SS

ModelMMBTRC101SS
PackageTO-236
BrandST
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ST MMBTRC101SS
Type
ST
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ST
Electronic Component
MMBTRC101SS
Electronic Component
1
Package
TO-236
Electronic Component
1 NPN
Electronic Component
Digital Transistor
Electronic Component
0.026g
Electronic Component
1
Electronic Component
BM0257710324
Resistor
1
Resistor
4.7kΩ
Transistor Type
NPN
Frequency(f T)
200MHz
Power Dissipation(Pd)
200mW
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MMBTRC101SS 产品概述

一、产品简介

MMBTRC101SS 是一款预偏置(digital/pre‑biased)NPN 晶体管,封装为 TO‑236(市面常见的 SOT‑23 小封装),由 ST(先科)提供。该器件将基极预置了偏置网络,便于直接与数字逻辑电平相连,用作开关或缓冲器。器件面向小功率开关与驱动场合,特点是工作电压高、开关速度快、使用简单。

二、主要参数

  • 晶体管类型:NPN,预偏置(数字晶体管)
  • 集-射极击穿电压 Vceo:50 V
  • 最大集电极电流 Ic:100 mA
  • 耗散功率 Pd(封装):200 mW(实际可用值与 PCB 散热有关)
  • 直流电流增益 hFE:30(典型)
  • 特征频率 fT:200 MHz(说明器件具备较好的高频开关能力)
  • 最小输入电压(VI(on)):2 V(达到导通条件)
  • 最大输入电压(VI(off)):1 V(达到关断条件)
  • 输出导通压 VO(on):约 300 mV(饱和电压,典型条件下)
  • 内部输入电阻:4.7 kΩ(输入端到基极的预置电阻,便于直接驱动)
  • 电阻比率:1(厂商提供的偏置网络比率参数,用于判定内部阻值关系)
  • 封装:TO‑236(SOT‑23 类似小外形)

三、内部结构与引脚(说明)

作为预偏置数字晶体管,器件内部常包含从输入引脚到基极的串联限流电阻(本件典型为 4.7 kΩ),以及用于避免误导通的泄放/下拉网络(厂商以电阻比率给出内部偏置关系,标注为 1)。这种内部集成使得器件可直接由 MCU/逻辑电平驱动,无需外部基极电阻,简化了外围电路设计。具体引脚功能请参考厂商封装图与引脚表。

四、适用场景

  • 数字逻辑到功率负载的接口驱动(继电器驱动需注意电流与反向电压保护)
  • LED 小电流驱动与指示灯控制(单颗 LED 或并联小电流)
  • 低功耗开关、通断控制与电平转换
  • 高频开关信号缓冲与放大(fT=200MHz 对开关速度有利)
  • 便携设备、消费电子、通信模块等空间受限的应用

五、设计与布局建议

  • 注意功耗与散热:封装 Pd 标称 200 mW,在实际板上需通过铜箔/散热过孔改善散热,避免长时间靠近最大耗散工作。
  • 电压与电流限制:实际电路应保证 Vce ≤ 50 V、Ic ≤ 100 mA;在接近极限条件下应留余量并做好热管理。
  • 输入电平门槛:若驱动端为 3.3 V 或 5 V MCU,TI/VI(on)=2 V 意味 3.3 V/5 V 可可靠打开;当输入低于 1 V 可认为处于关断态。
  • 保护措施:驱动感性负载时应并联整流二极管或添加限流/吸收元件,防止反向电压或瞬态破坏晶体管。
  • PCB 布局:输入引脚附近可不必额外并联基极电阻,但若有特殊上拉/下拉需求可在外侧增加;输出焊盘与地铜层应加大以利散热。

六、典型电路与使用建议

  • 直接驱动型:MCU IO ->(直接)MMBTRC101SS 输入,用于开关至负载(负载接在 Vcc 与集电极之间,发射极接地)。
  • 增强可靠性:在集电极并联保护二极管或 RC 吸收器以保护晶体管免受感性反冲。
  • 多级驱动:如需更大电流可用此件驱动功率晶体管或 MOSFET 的栅极/基极,从而实现功率放大。

七、选型与替代

当需要封装小、易直接由逻辑电平驱动且工作电压达数十伏的低功率开关元件时,MMBTRC101SS 为合适选择。若负载电流、功耗或电压要求更高,应选择更大封装或更高 Pd 的晶体管或外部基极电阻的分立件。比较时注意 hFE、VO(sat)、VI(on)/VI(off) 与内部偏置值是否满足系统要求。

总结:MMBTRC101SS 提供了集成偏置、易用性高、频率响应好和较宽电压范围的解决方案,适用于中低功率、要求简化外围电路的开关与驱动场合。购买与实际设计时请结合厂商完整 datasheet 和 PCB 热管理方案。

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